Microchip Technology 오실레이터
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카테고리수동 구성 요소 / 크리스탈, 오실레이터, 공진기 / 오실레이터
제조업체Microchip Technology
기록 8,544
페이지 256/285
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재고 있음 |
수량 |
시리즈 | 기본 공진기 | 유형 | 주파수 | 기능 | 출력 | 전압-공급 | 주파수 안정성 | 절대 풀 범위 (APR) | 작동 온도 | 전류-공급 (최대) | 평점 | 장착 유형 | 패키지 / 케이스 | 크기 / 치수 | 높이-착석 (최대) |
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Microchip Technology |
MEMS OSC LOW POWER 25MHZ LVCMOS |
8,892 |
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DSC1004 | MEMS | XO (Standard) | 25MHz | Standby (Power Down) | CMOS | 1.7V ~ 3.6V | - | ±10ppm | -40°C ~ 105°C | 8mA | AEC-Q100 | Surface Mount | 4-VDFN | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 0.035" (0.90mm) |
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Microchip Technology |
MEMS OSC LOW POWER 25MHZ LVCMOS |
5,652 |
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DSC1004 | MEMS | XO (Standard) | 25MHz | Standby (Power Down) | CMOS | 1.7V ~ 3.6V | - | ±10ppm | -40°C ~ 105°C | 8mA | AEC-Q100 | Surface Mount | 4-VDFN | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 0.035" (0.90mm) |
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Microchip Technology |
MEMS OSC 3.3V 40C TO +85C 25PPM |
7,326 |
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PureSilicon™ DSC1033 | MEMS | XO (Standard) | 3.6864MHz | Standby (Power Down) | CMOS | 3.3V | - | ±25ppm | -40°C ~ 85°C | 3mA (Typ) | - | Surface Mount | 4-SMD, No Lead | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) |
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Microchip Technology |
MEMS OSC 3.3V 40C TO +85C 25PPM |
5,382 |
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PureSilicon™ DSC1033 | MEMS | XO (Standard) | 3.6864MHz | Standby (Power Down) | CMOS | 3.3V | - | ±25ppm | -40°C ~ 85°C | 3mA (Typ) | - | Surface Mount | 4-SMD, No Lead | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) |
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Microchip Technology |
MEMS OSC 3.3V 40C TO +85C 25PPM |
2,250 |
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PureSilicon™ DSC1033 | MEMS | XO (Standard) | 7.3728MHz | Standby (Power Down) | CMOS | 3.3V | - | ±25ppm | -40°C ~ 85°C | 3mA (Typ) | - | Surface Mount | 4-SMD, No Lead | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) |
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Microchip Technology |
MEMS OSC 3.3V 40C TO +85C 25PPM |
3,564 |
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PureSilicon™ DSC1033 | MEMS | XO (Standard) | 7.3728MHz | Standby (Power Down) | CMOS | 3.3V | - | ±25ppm | -40°C ~ 85°C | 3mA (Typ) | - | Surface Mount | 4-SMD, No Lead | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) |
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Microchip Technology |
MEMS OSC LOW POWER LVCMOS 20C-7 |
5,994 |
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DSC1101 | MEMS | XO (Standard) | 16MHz | Standby (Power Down) | CMOS | 2.25V ~ 3.6V | - | ±50ppm | -20°C ~ 70°C | 35mA | - | Surface Mount | 6-VDFN Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
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Microchip Technology |
MEMS OSC LOW POWER LVCMOS 20C-7 |
3,240 |
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DSC1101 | MEMS | XO (Standard) | 16MHz | Standby (Power Down) | CMOS | 2.25V ~ 3.6V | - | ±50ppm | -20°C ~ 70°C | 35mA | - | Surface Mount | 6-VDFN Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
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Microchip Technology |
MEMS OSC LOW JITTER 16.384MHZ LV |
5,778 |
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DSC1101 | MEMS | XO (Standard) | 16.384MHz | Standby (Power Down) | CMOS | 2.25V ~ 3.6V | - | ±25ppm | -20°C ~ 70°C | 35mA | - | Surface Mount | 6-VDFN Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
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Microchip Technology |
MEMS OSC LOW JITTER 16.384MHZ LV |
3,564 |
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DSC1101 | MEMS | XO (Standard) | 16.384MHz | Standby (Power Down) | CMOS | 2.25V ~ 3.6V | - | ±25ppm | -20°C ~ 70°C | 35mA | - | Surface Mount | 6-VDFN Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
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Microchip Technology |
MEMS OSC LOW JITTER 84.672MHZ LV |
6,732 |
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DSC1101 | MEMS | XO (Standard) | 84.672MHz | Standby (Power Down) | CMOS | 2.25V ~ 3.6V | - | ±20ppm | -20°C ~ 70°C | 35mA | - | Surface Mount | 6-VDFN Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
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Microchip Technology |
MEMS OSC LOW JITTER 84.672MHZ LV |
8,208 |
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DSC1101 | MEMS | XO (Standard) | 84.672MHz | Standby (Power Down) | CMOS | 2.25V ~ 3.6V | - | ±20ppm | -20°C ~ 70°C | 35mA | - | Surface Mount | 6-VDFN Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
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Microchip Technology |
MEMS OSC LOW JITTER 90.3168MHZ L |
2,790 |
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DSC1101 | MEMS | XO (Standard) | 90.3168MHz | Standby (Power Down) | CMOS | 2.25V ~ 3.6V | - | ±20ppm | -20°C ~ 70°C | 35mA | - | Surface Mount | 6-VDFN Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
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Microchip Technology |
MEMS OSC LOW JITTER 90.3168MHZ L |
8,820 |
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DSC1101 | MEMS | XO (Standard) | 90.3168MHz | Standby (Power Down) | CMOS | 2.25V ~ 3.6V | - | ±20ppm | -20°C ~ 70°C | 35mA | - | Surface Mount | 6-VDFN Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
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Microchip Technology |
MEMS OSC LOW JITTER 98.304MHZ LV |
7,218 |
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DSC1101 | MEMS | XO (Standard) | 98.304MHz | Standby (Power Down) | CMOS | 2.25V ~ 3.6V | - | ±20ppm | -20°C ~ 70°C | 35mA | - | Surface Mount | 6-VDFN Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
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Microchip Technology |
MEMS OSC LOW JITTER 98.304MHZ LV |
3,618 |
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DSC1101 | MEMS | XO (Standard) | 98.304MHz | Standby (Power Down) | CMOS | 2.25V ~ 3.6V | - | ±20ppm | -20°C ~ 70°C | 35mA | - | Surface Mount | 6-VDFN Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
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Microchip Technology |
MEMS OSC LOW JITTER 22.5792MHZ L |
7,020 |
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DSC1101 | MEMS | XO (Standard) | 22.5792MHz | Standby (Power Down) | CMOS | 2.25V ~ 3.6V | - | ±10ppm | -20°C ~ 70°C | 35mA | - | Surface Mount | 6-VDFN Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
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Microchip Technology |
MEMS OSC LOW JITTER 22.5792MHZ L |
6,948 |
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DSC1101 | MEMS | XO (Standard) | 22.5792MHz | Standby (Power Down) | CMOS | 2.25V ~ 3.6V | - | ±10ppm | -20°C ~ 70°C | 35mA | - | Surface Mount | 6-VDFN Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
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Microchip Technology |
MEMS OSC LOW JITTER 24.576MHZ LV |
4,752 |
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DSC1101 | MEMS | XO (Standard) | 24.576MHz | Standby (Power Down) | CMOS | 2.25V ~ 3.6V | - | ±10ppm | -20°C ~ 70°C | 35mA | - | Surface Mount | 6-VDFN Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
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Microchip Technology |
MEMS OSC LOW JITTER 24.576MHZ LV |
8,190 |
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DSC1101 | MEMS | XO (Standard) | 24.576MHz | Standby (Power Down) | CMOS | 2.25V ~ 3.6V | - | ±10ppm | -20°C ~ 70°C | 35mA | - | Surface Mount | 6-VDFN Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
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Microchip Technology |
MEMS OSC LOW POWER LVCMOS 40C-8 |
8,928 |
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DSC1101 | MEMS | XO (Standard) | 8MHz | Standby (Power Down) | CMOS | 2.25V ~ 3.6V | - | ±50ppm | -40°C ~ 85°C | 35mA | - | Surface Mount | 6-VDFN Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
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Microchip Technology |
MEMS OSC LOW POWER LVCMOS 40C-8 |
6,336 |
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DSC1101 | MEMS | XO (Standard) | 8MHz | Standby (Power Down) | CMOS | 2.25V ~ 3.6V | - | ±50ppm | -40°C ~ 85°C | 35mA | - | Surface Mount | 6-VDFN Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
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Microchip Technology |
MEMS OSC LOW POWER LVCMOS 40C-8 |
7,038 |
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DSC1101 | MEMS | XO (Standard) | 27MHz | Standby (Power Down) | CMOS | 2.25V ~ 3.6V | - | ±25ppm | -40°C ~ 85°C | 35mA | - | Surface Mount | 6-VDFN Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
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Microchip Technology |
MEMS OSC LOW POWER LVCMOS 40C-8 |
6,660 |
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DSC1101 | MEMS | XO (Standard) | 27MHz | Standby (Power Down) | CMOS | 2.25V ~ 3.6V | - | ±25ppm | -40°C ~ 85°C | 35mA | - | Surface Mount | 6-VDFN Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
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Microchip Technology |
MEMS OSC LOW POWER LVCMOS 40C-8 |
4,464 |
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DSC1101 | MEMS | XO (Standard) | 60MHz | Standby (Power Down) | CMOS | 2.25V ~ 3.6V | - | ±10ppm | -40°C ~ 85°C | 35mA | - | Surface Mount | 6-VDFN Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
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Microchip Technology |
MEMS OSC LOW POWER LVCMOS 40C-8 |
3,366 |
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DSC1101 | MEMS | XO (Standard) | 60MHz | Standby (Power Down) | CMOS | 2.25V ~ 3.6V | - | ±10ppm | -40°C ~ 85°C | 35mA | - | Surface Mount | 6-VDFN Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
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Microchip Technology |
MEMS OSC LOW JITTER 125.0037MHZ |
7,668 |
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DSC1101 | MEMS | XO (Standard) | 125.0037MHz | Standby (Power Down) | CMOS | 2.25V ~ 3.6V | - | ±25ppm | -40°C ~ 85°C | 35mA | - | Surface Mount | 6-VDFN | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) |
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Microchip Technology |
MEMS OSC LOW JITTER 125.0037MHZ |
8,064 |
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DSC1101 | MEMS | XO (Standard) | 125.0037MHz | Standby (Power Down) | CMOS | 2.25V ~ 3.6V | - | ±25ppm | -40°C ~ 85°C | 35mA | - | Surface Mount | 6-VDFN | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) |
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Microchip Technology |
MEMS OSC LOW JITTER 25MHZ LVCMOS |
6,066 |
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DSC1101 | MEMS | XO (Standard) | 25MHz | Standby (Power Down) | CMOS | 2.25V ~ 3.6V | - | ±20ppm | -40°C ~ 85°C | 35mA | - | Surface Mount | 6-VDFN | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) |
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Microchip Technology |
MEMS OSC LOW JITTER 25MHZ LVCMOS |
7,560 |
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DSC1101 | MEMS | XO (Standard) | 25MHz | Standby (Power Down) | CMOS | 2.25V ~ 3.6V | - | ±20ppm | -40°C ~ 85°C | 35mA | - | Surface Mount | 6-VDFN | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) |