인터페이스-전문
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카테고리반도체 / 인터페이스 IC / 인터페이스-전문
기록 3,987
페이지 61/133
이미지 |
부품 번호 |
제조업체 |
설명 |
재고 있음 |
수량 |
시리즈 | 응용 프로그램 | 인터페이스 | 전압-공급 | 패키지 / 케이스 | 공급자 장치 패키지 | 장착 유형 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
IDT, Integrated Device Technology |
SENSOR SIGNAL CONDITIONER |
7,704 |
|
* | - | - | - | - | - | - |
|
|
|
NXP |
SYSTEM BASIS CHIP 2X 3.3 V/400M |
2,502 |
|
- | System Basis Chip | CAN, LIN | 5.5V ~ 28V | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | 32-SOIC-EP | Surface Mount |
|
|
|
NXP |
SYSTEM BASIS CHIP 2X 5.0 V/400M |
2,700 |
|
- | System Basis Chip | CAN, LIN | 5.5V ~ 28V | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | 32-SOIC-EP | Surface Mount |
|
|
|
IDT, Integrated Device Technology |
SENSOR SIGNAL CONDITIONER |
5,040 |
|
RBicLite™ | Sensor Signal Conditioner - Resistive | ZACwire™ One-Wire Interface | 2.7V ~ 30V | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC | Surface Mount |
|
|
|
IDT, Integrated Device Technology |
SENSOR SIGNAL CONDITIONER |
4,824 |
|
* | - | - | - | - | - | - |
|
|
|
IDT, Integrated Device Technology |
SENSOR SIGNAL CONDITIONER |
3,672 |
|
* | - | - | - | - | - | - |
|
|
|
IDT, Integrated Device Technology |
SENSOR SIGNAL CONDITIONER |
2,034 |
|
Automotive, AEC-Q100 | Sensor Signal Conditioner - Resistive | I²C, SENT, ZACwire™ | 4.75V ~ 5.25V | 24-VFQFN Exposed Pad | 24-QFN (4x4) | Surface Mount |
|
|
|
IDT, Integrated Device Technology |
SENSOR SIGNAL CONDITIONER |
4,374 |
|
Automotive, AEC-Q100 | Sensor Signal Conditioner - Resistive | I²C, SENT, ZACwire™ | 4.75V ~ 5.25V | 24-VFQFN Exposed Pad | 24-QFN (4x4) | Surface Mount |
|
|
|
NXP |
SYSTEM BASIS CHIP 2X 3.3 V/400M |
6,282 |
|
- | System Basis Chip | CAN | 5.5V ~ 28V | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | 32-SOIC-EP | Surface Mount |
|
|
|
NXP |
SYSTEM BASIS CHIP 2X 5.0 V/400M |
6,516 |
|
- | System Basis Chip | CAN | 5.5V ~ 28V | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | 32-SOIC-EP | Surface Mount |
|
|
|
NXP |
SYSTEM BASIS CHIP 2X 3.3 V/400M |
5,292 |
|
- | System Basis Chip | CAN, LIN | 5.5V ~ 28V | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | 32-SOIC-EP | Surface Mount |
|
|
|
NXP |
SYSTEM BASIS CHIP 2X 5.0 V/400M |
8,370 |
|
- | System Basis Chip | CAN, LIN | 5.5V ~ 28V | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | 32-SOIC-EP | Surface Mount |
|
|
|
NXP |
IC SYSTEM BASE W/CAN 48QFN |
2,250 |
|
- | Automotive | SPI Serial | 5.5V ~ 18V | 48-VFQFN Exposed Pad | 48-QFN-EP (7x7) | Surface Mount |
|
|
|
IDT, Integrated Device Technology |
SENSOR SIGNAL CONDITIONER |
3,474 |
|
* | - | - | - | - | - | - |
|
|
|
IDT, Integrated Device Technology |
SENSOR SIGNAL CONDITIONER |
4,176 |
|
* | - | - | - | - | - | - |
|
|
|
IDT, Integrated Device Technology |
SENSOR SIGNAL CONDITIONER |
5,040 |
|
* | - | - | - | - | - | - |
|
|
|
IDT, Integrated Device Technology |
SENSOR SIGNAL CONDITIONER |
6,696 |
|
Automotive, AEC-Q100 | Sensor Signal Conditioner - Resistive | I²C, ZACwire™ One-Wire Interface | 4.5V ~ 5.5V | 14-SSOP (0.209", 5.30mm Width) | 14-SSOP | Surface Mount |
|
|
|
NXP |
SYSTEM BASIS CHIP LIN 2X 3.3 V |
3,780 |
|
- | System Basis Chip | CAN, LIN | 5.5V ~ 28V | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | 32-SOIC-EP | Surface Mount |
|
|
|
NXP |
SYSTEM BASIS CHIPLIN 2X 5.0 V/ |
8,964 |
|
- | System Basis Chip | CAN, LIN | 5.5V ~ 28V | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | 32-SOIC-EP | Surface Mount |
|
|
|
IDT, Integrated Device Technology |
SENSOR SIGNAL CONDITIONER |
5,634 |
|
* | - | - | - | - | - | - |
|
|
|
IDT, Integrated Device Technology |
SENSOR SIGNAL CONDITIONER |
3,672 |
|
* | - | - | - | - | - | - |
|
|
|
IDT, Integrated Device Technology |
SENSOR SIGNAL CONDITIONER |
7,560 |
|
* | - | - | - | - | - | - |
|
|
|
IDT, Integrated Device Technology |
SENSOR SIGNAL CONDITIONER |
3,600 |
|
Automotive, AEC-Q100 | Sensor Signal Conditioner - Resistive | I²C, ZACwire™ One-Wire Interface | 4.5V ~ 5.5V | 14-SSOP (0.209", 5.30mm Width) | 14-SSOP | Surface Mount |
|
|
|
IDT, Integrated Device Technology |
SENSOR SIGNAL CONDITIONER |
6,408 |
|
* | - | - | - | - | - | - |
|
|
|
IDT, Integrated Device Technology |
SENSOR SIGNAL CONDITIONER |
3,114 |
|
* | - | - | - | - | - | - |
|
|
|
NXP |
SYSTEM BASIS CHIP LIN 2X 3.3 V |
4,032 |
|
- | System Basis Chip | CAN, LIN | 5.5V ~ 28V | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | 32-SOIC-EP | Surface Mount |
|
|
|
NXP |
SYSTEM BASIS CHIP LIN 2X 5.0 V |
2,934 |
|
- | System Basis Chip | CAN, LIN | 5.5V ~ 28V | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | 32-SOIC-EP | Surface Mount |
|
|
|
IDT, Integrated Device Technology |
SENSOR SIGNAL CONDITIONER |
6,354 |
|
* | - | - | - | - | - | - |
|
|
|
IDT, Integrated Device Technology |
SENSOR SIGNAL CONDITIONER |
2,016 |
|
* | - | - | - | - | - | - |
|
|
|
NXP |
IC SWITCH DETECT MULT 32-SOIC |
2,916 |
|
- | Switch Monitoring | SPI Serial | - | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | 32-SOIC-EP | Surface Mount |