Technology Articles

2012-03 Power Qualcomm

[3월 8 2012] Qualcomm has introduced the fifth generation of its embedded Gobi reference data connectivity platform, which can be used on mobile devices including ultra-thin laptops, tablets and dual-purpose tablets. Based on Qualcomm Gobi 4G LTE wireless baseband modem MDM9615 And MDM9215 This technology can provide fast LTE connectivity on global FDD and TDD networks, while being backward compatible with HS ...

2012-03 Connectors NXP

[3월 7 2012] NXP Semiconductors and FeliCa Networks announced that they will work closely to ensure that NXP's NFC family of RF controller solutions are interoperable with Japan's FeliCa™ (NFC-F) standard infrastructure. With NXP's single-chip NFC RF controller, device manufacturers will be able to design and produce handsets that are truly interoperable with global infrastructure. NXP and FeliCa Networks pla ...

2012-03 Power Renesas Electronics America

[3월 6 2012] Renesas Electronics and its subsidiary Renesas Mobile Corporation, a provider of advanced wireless modem solutions and platforms, Renesas Communications Technologies announced the MP5232, the first single-chip, high-performance, scalable smartphone platform for the $150- $300 product market. The MP5232 platform is designed to help Oems accelerate the production of LTE/HSPA+ enabled smartphones, t ...

2012-03 Power Renesas Electronics America

[3월 5 2012] Renesas Electronics Corporation announced the launch of a family of five low-power P-channel power metal oxide semiconductor field-effect transistors (MOSFETs). Includes µPA2812T1L optimized for uses such as charge control switches for lithium-ion (Li-ion) secondary batteries in notebook computers and power management switches for power conversion with AC adapters. In recent years, the demand for ...

2012-03 Connectors Microchip Technology

[3월 4 2012] Microchip Technology announced at the Embedded World Conference in Germany that its new 8-bit single-chip microcomputer (MCU) family featuring a new generation of analog and digital peripherals is ideal for general-purpose applications, as well as battery charging, LED lighting, ballast control, power conversion and system control applications. The PIC12F(HV)752 MCU integrates complementary outpu ...

2012-03 Semiconductors IDT, Integrated Device Technology

[3월 3 2012] IDT Corporation announced that it has introduced a new family of low-jitter silicon germanium (SiGe) surface acoustic (SAW) voltage-controlled oscillators (VCSO). Complementary to IDT's popular M675 series and high performance timing portfolio, the new product family is designed with higher frequency low jitter oscillators to meet the stringent requirements of fiber optic telecommunications appli ...

2012-03 Power Renesas Electronics America

[3월 2 2012] Renesas Electronics and its subsidiary Renesas Mobile Corporation, a provider of advanced wireless modem solutions and platforms, Renesas Communications Technologies announced the MP5232, the first single-chip, high-performance, scalable smartphone platform for the $150- $300 product market. The MP5232 platform is designed to help Oems accelerate the production of LTE/HSPA+ enabled smartphones, t ...

2012-03 Power Intel

[3월 1 2012] There is never enough capacity for AMD, and there often seems to be excess at Intel. At the end of 2010, Intel announced that it would use the new 22nm process to manufacture FPGA chips for Archronix Semiconductor, and subsequently set up a dedicated Foundry "Intel Custom Foundry". Now, Intel has won a second contract customer, or to manufacture 22nm FPGas for people. Tabula Inc., a provider of p ...

2012-02 Connectors Infineon Technologies

[2월 29 2012] Infineon Technologies has introduced a new family of XMC4000 32-bit microcontrollers using ARM® Cortex™-M4 processors. Infineon has used more than 30 years of experience in developing application-optimized peripherals with excellent real-time capabilities to design the XMC4000 product family, which combines the benefits of a widely adopted kernel architecture. The XMC4000 product family addresses ...

2012-02 Connectors Microchip Technology

[2월 28 2012] Microchip Technology announced the launch of a new family of 16-bit PIC24 Lite microcontroller (MCU) that combines ultra-low power (XLP) technology, low price, and low pin count packages, making it ideal for the most cost-sensitive applications in consumer, medical, and security. The PIC24F "KL" series has a typical hibernation current of 30 nA at 25 ° C and a typical operating current of 150 μA/ ...

2012-02 Connectors NXP

[2월 27 2012] NXP Semiconductors announced the introduction of the LPC1100LV series, the world's first ARM® Cortex™-M0 microcontroller that supports dual supply voltages from 1.65V to 1.95V VDD and 1.65V to 3.6V VIO. The LPC1100LV series is available in a 2mm x 2mm micro package with performance up to 50 MIPS and power consumption more than three times lower than comparable 3.3V VDD devices. The LPC1100LV plat ...

2012-02 Semiconductors TE Connectivity

[2월 26 2012] TE Circuit Protection, a business unit of TE Connectivity, today announced the availability of reflow Solderable thermal protection (RTP) devices for rated AC (AC) and rated DC (DC) with a 140°C disconnect temperature (TOPEN). The innovative RTP devices enable quick and easy installation using industry-standard component mount and lead-free reflow equipment, ensuring manufacturers achieve signifi ...