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SkyWater will acquire Infineon's Austin Fab and form a strategic partnership
2025-03
Semiconductors
Skyworks Solutions
[3월 6 2025] SkyWater Technology has signed an agreement with Infineon Technologies AG to acquire Infineon's 200 mm manufacturing plant in Austin, Texas (Fab 25), along with a corresponding long-term supply agreement. Under the agreement, SkyWater will manage and operate Fab 25 as a foundry, expanding domestic semiconductor production capacity to produce critical chips from 130 nm to 65 nm that are critical f ...

Emerson and Zitara Collaborate to Improve Battery Management Solutions
2025-03
Semiconductors
Epson Electronics
[3월 5 2025] Emerson, a global leader in industrial technology and advanced automation solutions, has announced a strategic partnership with Zitara Technologies, a pioneer in advanced battery management software. Through this collaboration, Zitara’s state-of-the-art software will be integrated into Emerson’s industry-leading Ovation™ automation platform, enhancing its capabilities and providing customers with ...

Infineon and Eaton expand their collaboration to bring AI-driven battery management solutions to industrial and consumer markets
2025-03
Semiconductors
Infineon Technologies
[3월 5 2025] Infineon Technologies AG and Eaton are expanding their existing collaboration on battery management solutions (BMS) for automotive applications to develop a comprehensive BMS portfolio covering various industrial and consumer sectors. Using Infineon's PSoC™ microcontroller, the collaboration combines the benefits of AI-driven battery optimization software with cutting-edge power semiconductor com ...

Infineon receives funding approval - IPCEI support accelerates innovation projects across Europe
2025-03
Semiconductors
Infineon Technologies
[3월 5 2025] Under the European Chip Act, the European Commission has officially approved funding for Infineon's smart power plant in Dresden. However, final funding approval from the Federal Ministry of Economic Affairs and Climate Action (BMWK), which oversees the spending of EU chip Bill funds, is still pending and is expected to be granted in the coming months. In addition, smart power fabs already benefi ...

TDK Corporation has extended the TDK-Lambda brand CCG family with two new options for 1.5W to 10W isolated DC-DC converters
2025-03
Connectors
TDK
[3월 5 2025] TDK Corporation has announced the expansion of its TDK-Lambda brand CCG Series of isolated DC-DC converters with the introduction of two new options in the 1.5W to 10W range. One of the latest improvements is the optional dual panel coating that provides additional protection for demanding environments such as industrial and railway applications. In addition, a larger 40-piece tray size has been ...

The future of quantum computing: What's unique about Microsoft's Majorana 1 chip?
2025-03
Semiconductors
Advantech Corp
[3월 4 2025] Quantum computing, a concept that once existed only in science fiction, is now moving toward reality. In this quantum race, Microsoft, with its unique topological quantum computing route, launched the high-profile Majorana 1 chip, which brings new hope for the future of quantum computing. 一.Challenges and opportunities of quantum computing While traditional computers use bits (0 or 1) to store an ...

The domestic real-time control MCU ushered in a new breakthrough: Jihai Technology launched G32R501
2025-03
Power
Jaro Components
[3월 4 2025] In modern industrial automation, smart home, Internet of Things and other fields, the demand for real-time control technology continues to rise. With the advancement of technology, the functions and performance of microcontrol units (MCUS) are constantly improving. Jihai Technology, as a well-known MCU design company in China, recently released its latest product - G32R501, marking an important b ...

Deep integration of smart technology and tactile sensors
2025-03
Sensors
Infineon Technologies
[3월 4 2025] The deep integration of intelligent technology and tactile sensors is one of the forefront directions of current science and technology development, and its core is to give tactile sensors more powerful perception, analysis and decision-making capabilities through artificial intelligence (AI), Internet of Things (IoT), big data analysis and other technologies. This convergence is driving breakthr ...

Semiconductor molding process revealed: The story behind the protection of chips
2025-03
Semiconductors
Amphenol ICC (FCI)
[3월 4 2025] In the modern technological society, semiconductor chips are everywhere, from smart phones to spacecraft, can not be separated from this tiny "brain". But what is less well known is that these sophisticated chips require special protection processes to perform their functions. Semiconductor molding process is such a key technology, it is like putting on a strong "armor" for the chip, so that it c ...

Melexis introduces high-performance magnetic position sensor chips
2025-03
Sensors
Melexis Technologies NV
[3월 3 2025] Melexis, a global microelectronics engineering company, has announced the launch of a dual-mode package (DMP) version of the MLX90425 magnetic position sensor chip, further expanding its family of magnetic position sensors. The new device follows the same package design as the existing MLX90364 and MLX90421, providing an easy upgrade path for automotive Tier 1 suppliers and original equipment man ...

High performance naked-eye 3D technology Reinventing art presentation: high-speed vision sensors
2025-02
Power
Ametherm
[2월 28 2025] In the Digital Art Gallery, visitors can enjoy vivid 3D artworks without wearing any auxiliary equipment. This revolutionary visual experience is thanks to breakthroughs in high-performance naked-eye 3D technology, where high-speed vision sensors play a key role. This technology is reshaping the way art is presented, bringing audiences unprecedented immersive experiences. 一.A breakthrough in glas ...

A new way of electro-optical interconnection: 3D packaging technology details
2025-02
Semiconductors
Amphenol Advanced Sensors
[2월 28 2025] With the rapid development of technologies such as artificial intelligence, 5G communication, and the Internet of Things, the performance improvement of traditional chips is gradually approaching the physical limit, and Moore's Law is facing failure. In order to break through this bottleneck, 3D packaging technology came into being and has become one of the key technologies to continue Moore's la ...