Master five processes to enhance the strength of wafer-level packaging

Wafer-level packaging (WLP) in the modern semiconductor industry. This is an advanced packaging technology, which is slowly becoming an important role in making electronic products smaller and more powerful! As technology continues to advance, the five major processes are understood, which are key to improving wafer-level packaging capabilities. Let's take a closer look at these five processes and how they work in wafer-level packaging.

1. Membrane technology

This film technology is one of the basic processes of wafer level packaging. You put a thin film on the surface of the wafer to form an electrical connection, and then you put a protective layer on top of it. The materials for such films are usually metals, insulators, and semiconductor materials. By physical vapor deposition (PVD) or chemical vapor deposition (CVD), these methods allow for high precision thin film deposition.

In wafer-level packages, thin film technology can be used not only to make conductive paths, but also to make passive components such as capacitors and inductors. The demand for high frequency and high speed of electronic devices is increasing, and the application of this thin film technology is becoming more and more extensive.

2. Micromachining technology

Micromachining technology is the key to high density packaging! Through lithography, etching, and deposition, micro - and even nanoscale structures can be created on wafers. With this technology, wafer-level packages can pack more functionality into a limited space.

Using this micromachining technology, wafer-level packaging can achieve smaller package sizes and higher integration, just to meet the needs of modern electronic products small and powerful. In addition, the technology can be used to fabricate complex three-dimensional structures, thereby improving the performance of the package.

3. Interconnection technology

Interconnect technology is an important part of wafer-level packaging. It is to build a bridge between the AR155A220K4RTR1 chip and the package. Common interconnection methods include ball bonding, wire bonding and copper column bonding.

The solder ball technology is one of the most common interconnection methods and can be used in most wafer-level packages. Gold wire bonding for high frequency, high speed applications with low inductance and resistance. Copper column bonding is particularly useful in high-power applications, where it can withstand higher currents.

4. Packaging material technology

The choice of packaging materials is too important for the performance of wafer level packaging. Commonly used packaging materials are epoxy resin, polyimide and ceramics. These materials require not only good electrical properties, but also excellent thermal management and mechanical strength.

With the development of technology, new packaging materials continue to emerge. For example, low-permittivity materials (low permittivity) are used more often in high-frequency circuits to reduce signal delay and power consumption. In addition, the application of hot materials is becoming more and more important, to ensure that the thermal management of the package in high-power applications is not a problem.

5. Test and reliability technology

Testing and reliability technology is an important part of ensuring the quality of wafer-level packaging. By conducting electrical, thermal, and mechanical tests on packages, you can estimate their performance and reliability.

In wafer-level packaging, testing techniques continue to advance and can be fully evaluated before the package is ready. This can not only improve production efficiency, but also reduce the rate of defective products. In addition, reliability testing can help engineers identify potential problems so that improvements can be made during the design phase.

Understanding these five processes can not only improve the technical level of wafer-level packaging, but also drive the entire semiconductor industry forward! As the demand for high-performance, low-power electronics continues to rise, technological innovation in wafer-scale packaging will continue to lead the industry into the future!