Molex introduces NeoPress high-speed sandwich system
Molex introduces the NeoPress high-speed sandwich system. Nadine Dytko-Madsen, New product Development Manager at Molex, said: "Modular systems with adjustable differential pairs, low stack heights, compliant pin ends and interlaced interface configurations can deliver data rates of up to 28 Gbps. This is ideal for new, space-constrained telecommunications, automation, and medical applications that require higher speeds and smaller form factors." The mirroring interface enables compact stack heights and simplifies routing operations for printed circuit boards.
Dytko-Madsen added: "Sometimes, printed circuit boards need to be reused or reworked. Traditional SMT connectors are connected in a permanent manner, making it virtually impossible to reuse the printed circuit board. Moreover, if the SMT termination fails at a certain point, it will cause a short circuit if it is to be reworked. As an alternative, pressure-fit sandwich connectors allow reuse, but generally reduce signal integrity."
The NeoPress system addresses these issues by providing compliant pin terminations while minimizing near-end and far-end crosstalk and achieving the signal integrity of NeoScale™ SMT connectors. In addition, compliance pins allow designers to rework the board without sacrificing signal integrity while maximizing system effects.
The modular, patent-pending three-chip design includes high-speed differential pairs with impedance adjustable to 85 to 100 ohms, enabling a flexible and customizable system. System options include four three-way configurations, high-speed single-ended paths, and low-speed single-ended line-to-power contacts. These options enable printed board designers to support low - and high-speed signal and power needs with a single compact connector, saving space on the printed board.
The system is ideal for high-density telecommunications and networking equipment such as hubs, servers, NAS towers and rack-mounted servers. It can also be used in industrial automation and medical applications.
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