Molex introduces electrocredit enhanced zSFP+ SMT 20-way interconnect solution

     Molex introduces the enhanced Small Size Pluggable + (zSFP+) Surface Mount Technology (SMT) 20-way connector that delivers outstanding performance for high-speed telecommunications and data communications equipment. Designed specifically for 25 Gbps serial channels in high-speed Ethernet and Fibre Channel, the new zSFP+ interconnect components are scalable for next generation applications and provide the best electromagnetic interference (EMI) and signal integrity (SI) margins in 10 and 16 Gbps channels.

     The backward compatible zSFP+ connector offers the same plug-in interface and EMI shield dimensions as the SFP+ connector, with preferential coupling design with in-molding technology and narrow-edge coupling masking and molded contact shapes for excellent signal, mechanical and electrical performance. At the same time, compared with the current SFP+ products, the resonance is greatly reduced. Components of the new zSFP+ interconnect system include zSFP+ SMT 20-way connectors, stacked integrated connectors, and passive optical cable components.

     Joe Dambach, New product Development Manager at Molex, said: "SFP connectors and laminated integrated connectors have made major design improvements to achieve and optimize performance for next-generation applications. In central offices and multi-platform data systems, the new zSFP+ SMT technology provides a fully integrated solution for upgrades and designs for memory, switches, routers and hubs."

     The zSFP+ SMT 20-way connector has the same PCB footprint, plug-in interface, and EMI shield size, and can be used as a drop-in alternative to current SFP+ form-factor motherboard designs for full backward compatibility. Its high-temperature thermoplastic housing can withstand lead-free processes, and single-port and 1x ganged shielding supports multiple port number applications and options at a cost comparable to SFP+ shielding, and can be shared with different board thicknesses and assembly processes to meet server and switch application requirements. The modular shield is available with two, four or six ports for a variety of design options.

     Laminated integrated connectors and shields can be used in push-down applications, eliminating reflux assembly and offering a space-saving compact design for easy machining. Internal longitudinal shielding provides unmatched EMI reduction performance. The push-down tail is suitable for belly-to-belly applications and is used for single and group adjustment shields to maximize space use of printed circuit boards (PCBS). Optional rear - and side-mounted light guide cover assemblies allow for flexible routing of the LED's PCB signal, providing the user with feedback on port status and activity.

     The Molex Fiber LC twin-core cable assembly with OM3/OM4 fiber uses the zSFP+ optical module to provide a high-performance interconnect solution with custom length options and strain relief bushings including straight, 45 and 90 degree angles. The LC twin-core connector using OM3/OM4 fiber provides the higher transmit bandwidth required for next-generation zSFP+ devices, which meets EIA-TIA and FOCIS 10 standards and is suitable for MSA devices.

     Dambach added, "The enhanced zSFP+ connector products provide an excellent plug-in component for emerging 25 Gbps designs, and Molex customers have already benefited from the additional signal integrity margin gained by implementing the enhanced zSFP+ solution on today's low-speed boards."