NXP Semiconductor announces new SOT1226 "Diamond" package

     NXP Semiconductors has released the new SOT1226 "Diamond" package, the world's smallest general-purpose logic package with a unique pad spacing design. Measuring just 0.8 x 0.8 x 0.35-mm, the new SOT1226 comes in a pin-free plastic package that is 25% smaller than the previous world's smallest logic package, the NXP SOT1115.

     Despite its smaller size, the SOT1226 has a pad spacing of 0.5-mm, which is 50% higher than before, making welding easier and saving engineers time and costs. The package is ideal for cutting-edge portable device designs such as smartphones, where PCB space is critical. The unique shape of the diamond package provides a space-saving logic solution that minimizes equipment and does not increase manufacturing costs associated with smaller pad spacing modes.

     Typical package manufacturing processes use 0.3-mm or 0.35-mm pad spacing, requiring the use of step-down masks by electronic manufacturing services (EMS) and packaging plants in order to successfully install the device on the PCB. Because the diamond package has a large pad spacing (up to 0.5-mm), the use of step-down masks is no longer required during the welding process, saving the manufacturer costs. In addition, the large pad spacing of the diamond package provides greater contact space, making component layout easier and improving joint strength and stability while reducing the risk of short circuits. The larger pad spacing allows PCB packers to avoid costly errors such as accidental bridging between tin Bridges or contacts, which can render electrical equipment unusable.

     Kristopher Keuser, Director of Marketing at NXP's Semiconductor Logic business, said: "Mobile device designers are often faced with the challenge of adding more features into a smaller portable device space, which in turn creates more challenges. NXP's new diamond package is a game-changing solution that allows our customers to design in a smaller geometric space without increasing manufacturing costs, and to standardize their entire product portfolio. This product demonstrates NXP's commitment to industry leadership and innovation, as well as its understanding of the market, where smaller, cheaper and more reliable solutions are now the driving force."