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QUALCOMM introduced two new Qualcomm Snapdragon processors

9월 22 2015 2015-09 Power Qualcomm
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QUALCOMM Inc. announced that its subsidiary Qualcomm Technologies, Inc., has introduced two new QUALCOMM® Snapdragon processors. The new chipsets, Snapdragon 430 and Snapdragon 617, offer the development of two multimedia and web-connected mid-range mobile devices.

     QUALCOMM Inc. announced that its subsidiary Qualcomm Technologies, Inc., has introduced two new QUALCOMM® Snapdragon processors. The new chipsets, Snapdragon 430 and Snapdragon 617, offer the development of two multimedia and web-connected mid-range mobile devices.

     The Snapdragon430 has X6 LTE, with Category 4 downlink rates of up to 150 Mbps and support for carrier aggregation of 2×10 MHz, and upstream speeds by supporting 64-QAM Cat 5 of up to 75 Mbps - the first in this tier. The Snapdragon 430 supports dual camera configurations and sensors up to 21MP for excellent image quality. The Snapdragon 430 takes advantage of the powerful new QUALCOMM Adreno505 GPU features such as open GL ES3.1, Android extension packs, and OpenCL 2.0. Combining features previously limited to a high level, Snapdragon's 617 on-board connectivity and Snapdragon's 430 capabilities increase the global demand for faster LTE data transfer rates.

     Equipped with Caterpillar, it supports 7 download speeds of up to 300 Mbps, and utilizes bi-directional 2×20 MHz carrier aggregation for upload speeds of up to 100 Mbps. It also shares the same software advancements as Snapdragon's 620 and 618. In addition, the architecture of dual ISP and camera, the same software package running Snapdragon 617,618 and 620, enables Oems to offer these products quickly and efficiently. For optimal RF performance, the 617 and 430 are paired with the WTR 2965, a new cost-optimized RF transceiver for global carrier aggregation.

     Both the Snapdragon 617 and 430 use energy-efficient ARM®Cortex™A53 processors in eight-core configurations. Both parties also include support for QUALCOMM® Fast Charging ™3.0, the next generation of fast charging technology. Each features a high-performance, low-power QUALCOMM® Hexagon ™DSP that supports low-power sensors and advanced audio. The Snapdragon 430 and 617 Snapdragon will fast track the regional certification process with support from the QUALCOMM® Global Pass Certification Program.

     "As smartphones and tablets continue to spread to all corners of the globe, we recognize that users are becoming more selective about what they want," Alex Katouzian, senior vice president, Product Management, Qualcomm Technologies, said in the introduction that the new processors are available at all price points, making it clear that we are listening to the needs of our customers who want to continuously improve cameras, with faster connection speeds and longer battery life. "

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