STMicroelectronics introduces automotive SiC power modules in dual-inline package

     STMicroelectronics has introduced the 32-pin, dual-inline, molded, through-hole ACEPACK DMT-32 family of SiC power modules for automotive applications. Designed for systems such as onboard chargers (OBC), DC/DC converters, fluid pumps, and air conditioning, these components feature a high-power density, a very compact design, and a simplified assembly process. The product family provides system designers with a selection of four-pack, six-pack, and totem-pole configurations to increase their flexibility.

     The modules include 1,200V SiC power switches that utilize ST's cutting-edge second and third-generation SiC MOSFETs technology to ensure minimal RDS(on) values. The devices provide efficient switching performance with minimal temperature dependence to assure high system efficiency and reliability.

     The modules include 1,200V silicon carbide (SiC) power switches that utilize ST's cutting edge second and second third-generation SiC Power MOSFETs, a well-recognized technology thanks to their superior performance in terms of electrical characteristics and thermal behavior, which guarantees low RDS(on) and limited switching energies. Thanks to the direct bonded copper (DBC) packaging based on aluminum nitride, this module ensures higher thermal conductivity, which is related to a very low thermal resistance as well as high electrical insulation.

     Utilizing ST’s tried-and-true ACEPACK technology, the modules reduce system and design development costs while assuring exceptional reliability. The packaging technology incorporates a substrate insulated with high-performance aluminum nitride (AlN) for superior thermal performance. In addition, there is an integrated NTC sensor that monitors temperature for thermal protection.