TE Circuit Protection introduces 8 single/multi-channel silicon electrostatic discharge protection devices

     TE Circuit Protection, a business unit of TE Connectivity, today announced a new family of eight single/multichannel silicon electrostatic discharge (SESD) protection devices that deliver the lowest capacitance on the market (bi-directional: typical value 0.10pF, unidirectional: Typical value is 0.20pF), highest ESD protection (20kV air discharge and contact discharge) and smallest package size (multi-channel: smallest straight-through form factor size, thickness 0.31mm).

     The ultra-low capacitance of these SESD devices results in the industry's lowest insertion power consumption, which is critical to maintaining signal integrity in ultra-high-speed applications. The device helps protect against damage caused by electrostatic discharge, surge and cable discharge. Multichannel devices also feature a specially designed pass-through package that allows for a matched impedance of printed circuit board (PCB) wiring, which is essential for maintaining the integrity of high-speed signals. SESD devices with ultra-low capacitance, small size and high electrostatic discharge protection ratings are ideal for smartphones, similar consumer electronics such as HDTVS, automotive and other markets that use current and future highest rate interfaces. These interfaces include USB3.0/2.0, HDMI, eSATA, DisplayPort, and Thunderbolt.

     These single/multi-channel SESD devices feature industry-leading contact and air discharge ratings of 20kV, exceeding the 8kV defined by the industry standard IEC61000-4-2. This high voltage rating minimizes the risk of permanent port failure due to a short circuit in an ESD device, or damage due to electrostatic discharge that opens the ESD device and exposes the downstream chipset. This feature reduces customer complaints and warranty costs.

     "ESD protection devices add capacitance to the data line, which can cause signal integrity issues that affect product performance and interoperability. Today's high-speed ports require ESD devices with the lowest capacitance to provide the highest level of protection with the least impact on signal transmission, "said Patrick Hibbs, global Marketing and ESD business Manager, TE Circuit Protection. "Our new SESD devices provide a capacitance value that is 92% lower than competing 'ultra-low capacitance' solutions, which means our SESD devices can meet today's 'Thunderbolt' applications." "Even in emerging markets such as 4K Ultra-High definition (UHD) and 1/4 high-definition television (QHD), our SESD devices can be adapted for these applications."

     As the size of consumer electronics continues to shrink, TE Circuit Protection SESD devices bring a size advantage in the ongoing miniaturization trend. The single-channel devices are already available in the 0201 XDFN small occupancy area (0.6mm x 0.3mm x 0.31mm) package and the 0402 XDFN (1.0mm x 0.6mm x 0.38mm) package. Multichannel SESD arrays (2, 4, 6 channels optional) offer package heights as low as 0.31mm - up to 50% lower than competing devices. The low overall height of the SESD device allows it to be mounted on the edge of the PCB board, or between the board and the connector, increasing the flexibility of the design.

     In addition, a miniaturized four-channel SESD array can be used in a board area that is smaller than four 0201 devices, resulting in reductions in board area, assembly costs, and device costs. As the smallest 4 - and 6-channel pass-through arrays on the market, these devices are still easy to wire when used with applications that employ micro-connectors such as HDMI Type D, mini DisplayPort, Thunderbolt, and USB 3.0 Micro-B.