TE Connectivity announced the launch of the new LGA 3647 IC socket

     TE Connectivity, a global leader in connectivity and sensors, announced the introduction of the LGA 3647 socket for a new processor specific to Intel's latest server platform. The new LGA 3647 socket offers increased performance and improved system scalability to meet the next generation design requirements of the latest cpus. As one of the few vendors to offer this technology, TE will provide key technology support for this new socket for new platforms in the data center and high performance computing (HPC).

     TE's LGA socket enables the processor and printed circuit board (PCB) to be connected to the PCB by applying pressure. With the increase of computing power, the number of pins in the processor chip is also increasing. The LGA 3647 is the first LGA socket to feature a two-piece design for larger processors and offers better flatness, reliability and connectivity while improving warping issues. In addition, TE provides flexible tools to enable rapid production of product prototypes, helping engineers obtain socket samples at the initial stage of the design process.

     Jaren May, Product management Manager, TE's Data and Terminal Devices Business group, said: "With the adoption of new cpus in the latest server platforms and HPC solutions, designers need CPU sockets that enable high performance and reliable connectivity. "The new LGA 3647 socket will help designers complete new system designs and demonstrate leading performance through robust design to meet the technical requirements of the next generation of processors."