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The first automotive multi-domain SoC with 3nm process technology

11월 28 2024 2024-11 Semiconductors Renesas Electronics America
Article Cover
Renesas Electronics Corporation has launched the new generation of automotive fusion SoCs serving multiple automotive domains including ADAS, IVI, and gateway applications on a single-chip. Built employing the latest 3nm automotive process technology, the highly anticipated R-Car X5H SoC, which is the first device in the R-Car X5 series, delivers the highest level of integration and performance in the industry, allowing OEMs and Tier 1s to shift to centralized ECUs for streamlined development and future-proof system solutions.

     Renesas Electronics has introduced a new generation of automotive converged SoCs that serve multiple automotive segments, including ADAS, IVI and gateway applications, on a single chip. The highly anticipated R-Car X5H SoC features the latest 3nm automotive process technology and is the first device in the R-Car X5 family with the highest level of integration and performance in the industry, allowing Oems and Tier 15s to turn to centralized ECUs to simplify development and future-proof system solutions. Thanks to its unique hardware-based isolation technology, it is the first company in the industry to offer highly integrated security processing solutions for multiple automotive segments on a single chip. In addition, the new SOCs offer the option to extend AI and graphics processing performance using chip technology.

     As the highest performing device in the fifth-generation (Gen 5) R-Car family, the R-Car X5H directly addresses the growing complexity of software-defined vehicle (SDV) development. These challenges include optimizing computing performance, power consumption, cost, hardware and software integration, while ensuring vehicle safety. By tightly coupling application processing, real-time processing, GPU and AI computing, large display capabilities, and sensor connectivity on a single chip, these devices enable new types of autonomous driving, IVI, and gateway applications.

     The new SoC family allows AI acceleration up to 400TOPS with industry-leading TOPS/W performance and GPU processing up to 4TFLOPS. It integrates 32 Arm Cortex-A720AE CPU cores for application processing, delivering over 1,000K DMIPS of performance. And six Arm Cortex-R52 bi-synchronous CPU cores that deliver over 60K DMIPS performance and support ASIL-D functionality without the need for an external mcu. Manufactured with one of TSMC's most advanced process nodes, the new SoC family achieves both high-end CPU performance and 30 to 35 percent lower power consumption compared to devices designed with 5nm process nodes. These energy-saving features eliminate the need for additional cooling solutions, significantly reducing overall system costs while extending the vehicle's driving range.

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