Toshiba has developed two new process technologies and microcontroller wireless communication ics
Toshiba Corporation announced that it has developed an embedded processing based on 65nm logic process flash memory using less power than the current mainstream technology and a single-layer polysilicon non-volatile memory (NVM) process based on a 130nm logic and analog power supply process. Different applications in the application optimization process will allow Toshiba to expand its product lineup in such areas as microcontrollers, wireless communication chips, motor controller drivers and power ics.130nm -NVM and 65nm- flash sample deliveries are scheduled for the fourth quarter of 2015 and the second quarter of 2016, respectively.
The iot market is seeing strong demand in low-power segments including wearables and medical-related devices. In response, Toshiba has adopted SST's [2] third-generation SuperFlash battery technology, combined with its own 65nm logic process technology. The company has also developed finely tuned circuits and manufacturing processes for embedded ultra-low power flash logic processes. Microcontrollers for consumer and industrial applications can reduce power consumption to about 60% compared to current mainstream technologies.
Following the first series of microcontrollers, Toshiba plans to launch samples of BLE (Bluetooth Low Power) products, short range wireless technology, in fiscal year 2016 the company also plans to apply the 65nm process for its wireless communication IC product family, which can optimize the utilization of low power characteristics, including NFC (Near Field communication) controllers and contactless cards.
In addition to the advantages of low power consumption, the technique of the method helps to shorten development time, as application software can be easily written and rewritten to flash memory during development.
By providing ultra-low power consumption in devices to facilitate the further development of flash peripheral circuit technology and specialized logic circuit and analog circuit technologies, Toshiba Corporation will continue to grow in meeting the demand for low power applications. The company's aim is to reduce power consumption throughout the system, working for 50μA/ MHz, and develop innovative products for the Internet of Things.
Significant cost reduction in applications is an issue, and Toshiba has developed an embedded NVM process using YMC's [3] monopolymer MTP (multiple programmable) cells Toshiba's 130nm logic process technology.
While limiting the lithography of the mask pattern to three or fewer additional steps, even without imposing MTP specifications for write times improves the performance of the new process. NVM and analog circuits are embedded in a single chip that can be incorporated by a multi-chip system typically performing multiple functions. This reduces the number of terminals and enables a smaller package.
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