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Intersil introduces 12-cell lithium-ion battery pack monitors
2016-11
Connectors
Intel
[11월 28 2016] Intersil Corporation, a leading provider of innovative power management and precision simulation solutions, announced the launch of the 12-cell lithium-ion battery pack monitor ISL78610. The device provides battery equalization and accurate voltage and temperature monitoring to protect lithium-ion battery packs in hybrid, plug-in hybrid and pure electric vehicles. System designers can use the ISL ...
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The new Brad M40 plastic-coated wire set has a short plastic-coated length
2016-11
Connectors
Molex
[11월 27 2016] Molex introduces the Brad M40 plastic-coated wire set, which is designed for high power applications such as servo motors. Molex's portfolio of circular connector plastic-coated wire sets currently ranges in size from M5 to M40, while the M40 specification has been expanded to include field wiring connectors as well as panel mount sockets. Hannah Lena Gehring, Product Manager at Molex, said: "The ...
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On Semiconductor introduces sensorless three-phase motor controllers for automotive BLDC
2016-11
Semiconductors
ON Semiconductor
[11월 26 2016] ON Semiconductor introduces the LV8907UW to further expand its motor controller product lineup. This high-performance, feature-rich device supports a range of operating voltages from 5.5V to 20V (4.5V to 40V transient), enabling a streamlined solution for driving three-phase brushless motors. The LV8907UW integrates gate drivers to drive six N-channel MOSFETs and a two-stage charge pump for 100% ...
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Qorvo launches a new power multiplier to expand its DOCSIS 3.1 CATV product line
2016-11
Connectors
Qorvo US Inc.
[11월 25 2016] Qorvo, a leading provider of RF solutions for mobile, infrastructure and aerospace and defense applications, announced the launch of three new power multiplier multi-chip modules (MCM) supporting DOCSIS 3.1 - the RFCM3327, RFCM3328 and QPB8808. Qorvo's latest power multiplier MCM amplifiers offer cable broadband service providers an easy path to DOCSIS 3.1 with maximum design flexibility and func ...
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The Dialog System PMIC can power any single - or dual-core ARM Cortex A series processor
2016-11
Semiconductors
Dialog Semiconductor GmbH
[11월 24 2016] Dialog Semiconductor Corporation announced that its DA9061 and DA9062 Power management Integrated circuits (PMIC) are now available in volume. These efficient, cost-optimized PMics are capable of powering a wide range of processor-based devices. Applications include handheld consumer electronics, industrial-grade embedded, smart home and automotive systems. The DA9061 and DA9062 PMIC can be power ...
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Bourns introduces a new range of high-power, ultra-low ohm current detection resistors
2016-11
Passive Components
Bourns
[11월 23 2016] Bourns introduces a new series of high-power, ultra-low ohm current detection resistors -CSS. This latest current measurement device can help power electronics developers save energy and improve the performance detection of their product designs. The CSS family of products has a low resistance temperature coefficient (TCR) to maintain operational accuracy and demonstrate long-term stability over ...
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Diodes brushless DC full bridge motor drivers provide PWM or DC voltage speed control
2016-11
Connectors
Diodes Incorporated
[11월 22 2016] Diodes Corporation introduces the AM9468 and AM9469 brushless DC motor drivers with bridge-tied load (BTL) drive architectures to minimize audible switching noise and electromagnetic interference (EMI). Provides intelligently driven cooling fans in laptops and desktop computers, instrumentation and similar devices, and supports a wide range of other medium voltage, low power motor drive applicati ...
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Power Integrations introduces the LYTSwitch-1 LED driver IC
2016-11
Semiconductors
Power Integrations
[11월 21 2016] Power Integrations, the world leader in high efficiency, high reliability LED driver ics, introduces the LYTSwitch™-1 single-stage non-isolated step-down LED driver IC product line. The small size of the IC enables the design of LED bulbs and tubes with high constant current accuracy, and the number of components used is very small. Innovative driver algorithms guarantee high power factor (PF) an ...
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Vishay's new automotive-grade MLCC is extremely reliable and can operate at industrial-grade temperatures of +175 ° C
2016-11
Semiconductors
Vishay
[11월 20 2016] Vishay Intertechnology has announced the launch of a new series of automotive grade axial lead multilayer ceramic chip capacitors (MLCC) capable of operating in most extreme automotive conditions. H Series "HOTcap" devices. Vishay BCcomponents K... The H Series "HOTcap" devices operate at temperatures up to +175 ° C, the highest temperature currently available for all ceramic dielectrics, with ca ...
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Qorvo's new GaN 50V transistor significantly improves system power performance
2016-11
Passive Components
Qorvo US Inc.
[11월 19 2016] Qorvo, a leading provider of RF solutions for mobile, infrastructure and aerospace and defense applications, announced the launch of six new 50V gallium nitride (GaN) transistors - the QPD1009 and QPD1010, as well as the QPD1008(L) and QPD1015(L). Specifically designed to optimize power performance for commercial radar, communications systems and avionics applications. Roger Hall, General Manager ...
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Silicon Labs USB Type-C reference design gets developers up and running quickly
2016-11
Power
Silicon Labs
[11월 18 2016] Silicon Labs has introduced a complete reference design designed to reduce the cost and complexity of developing cables and cable adapters based on the USB Type-C™ specification. Silicon Labs' new USB Type-C reference design features a low-cost, ultra-low-power EFM8 microcontroller (MCU), USB Developers Forum (USB-IF) certified USB Power Transfer (PD) protocol stack, and USB Billboard device sour ...
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Infineon joins hands with IMEC to develop automotive 79 GHz CMOS radar sensor chips
2016-11
Power
Infineon Technologies
[11월 17 2016] IMEC, the world's leading microelectronics research center, and semiconductor manufacturer Infineon Technologies have announced that they are collaborating on the development of CMOS sensor chips. Under an agreement announced at the annual IMEC Technology Forum (ITF Brussels 2016) in Brussels, Infineon and IMEC will work together to develop a highly integrated CMOS process 79 GHz sensor chip for ...