NXP PMIC-전력 관리-전문
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카테고리반도체 / 전력 관리 IC / PMIC-전력 관리-전문
제조업체NXP USA Inc.
기록 595
페이지 14/20
이미지 |
부품 번호 |
제조업체 |
설명 |
재고 있음 |
수량 |
시리즈 | 응용 프로그램 | 전류-공급 | 전압-공급 | 작동 온도 | 장착 유형 | 패키지 / 케이스 | 공급자 장치 패키지 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
NXP |
FS4500 |
7,128 |
|
Automotive, AEC-Q100 | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
|
|
|
NXP |
SYSTEM BASIS CHIP DCDC 1.5A VCO |
3,096 |
|
- | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
|
|
|
NXP |
SYSTEM BASIS CHIP DCDC 1.5A VCO |
5,850 |
|
- | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
|
|
|
NXP |
IC POWER MANAGEMENT 206MAPBGA |
2,862 |
|
- | General Purpose | - | 1.8V ~ 4.5V | -40°C ~ 85°C | Surface Mount | 206-LFBGA | 206-MAPBGA (13x13) |
|
|
|
NXP |
IC POWER MANAGEMENT |
3,636 |
|
- | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
|
|
|
NXP |
IC POWER MANAGEMENT I.MX8QXP |
6,102 |
|
- | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
|
|
|
NXP |
IC POWER MANAGEMENT I.MX8QM |
6,516 |
|
- | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
|
|
|
NXP |
IC POWER MANAGEMENT I.MX8QXP |
4,644 |
|
- | High Performance i.MX 8, S32x Processor Based | - | 2.7V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
|
|
|
NXP |
IC POWER MANAGEMENT I.MX8QM |
8,244 |
|
- | High Performance i.MX 8, S32x Processor Based | - | 2.7V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
|
|
|
NXP |
IC POWER MANAGEMENT I.MX8QM |
8,946 |
|
- | High Performance i.MX 8, S32x Processor Based | - | 2.7V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
|
|
|
NXP |
IC POWER MANAGEMENT I.MX8QM |
8,028 |
|
- | High Performance i.MX 8, S32x Processor Based | - | 2.7V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
|
|
|
NXP |
FS6500 |
4,824 |
|
Automotive, AEC-Q100 | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
|
|
|
NXP |
SBC, DCDC 1.5A VCORE FS1B CAN,15 |
7,596 |
|
Automotive, AEC-Q100 | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
|
|
|
NXP |
IC ENGINE CTRL SW/DVR 54-SOIC |
6,642 |
|
- | Automotive | 10mA | 5V ~ 36V | -40°C ~ 125°C | Surface Mount | 54-SSOP (0.295", 7.50mm Width) Exposed Pad | 54-SOIC-EP |
|
|
|
NXP |
FS6500 |
5,994 |
|
Automotive, AEC-Q100 | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
|
|
|
NXP |
SYSTEM BASIS CHIP DCDC 2.2A VCO |
8,964 |
|
- | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
|
|
|
NXP |
FS6500 |
3,384 |
|
Automotive, AEC-Q100 | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
|
|
|
NXP |
SYSTEM BASIS CHIP DCDC 0.8A VCO |
4,626 |
|
- | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
|
|
|
NXP |
FS4500 |
6,066 |
|
Automotive, AEC-Q100 | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
|
|
|
NXP |
IC POWER MANAGEMENT I.MX8QM |
5,922 |
|
- | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
|
|
|
NXP |
IC POWER MANAGEMENT I.MX8QM |
7,848 |
|
- | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
|
|
|
NXP |
IC POWER MANAGEMENT I.MX8QXP |
4,284 |
|
- | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
|
|
|
NXP |
IC POWER MANAGEMENT I.MX8QM |
7,236 |
|
- | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
|
|
|
NXP |
IC POWER MANAGEMENT LS1046A |
5,256 |
|
- | High Performance i.MX 8, S32x Processor Based | - | 2.7V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
|
|
|
NXP |
IC POWER MANAGEMENT I.MX8QM |
1,292 |
|
- | High Performance i.MX 8, S32x Processor Based | - | 2.7V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
|
|
|
NXP |
IC POWER MANAGEMENT I.MX8QM |
108 |
|
- | High Performance i.MX 8, S32x Processor Based | - | 2.7V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
|
|
|
NXP |
IC POWER MANAGEMENT I.MX8QM |
7,614 |
|
- | High Performance i.MX 8, S32x Processor Based | - | 2.7V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
|
|
|
NXP |
FS6500 |
2,826 |
|
Automotive, AEC-Q100 | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
|
|
|
NXP |
FS6500 |
3,472 |
|
Automotive, AEC-Q100 | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
|
|
|
NXP |
SYSTEM BASIS CHIP DCDC 1.5A VCO |
2,502 |
|
- | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |