인터페이스-텔레콤
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카테고리반도체 / 인터페이스 IC / 인터페이스-텔레콤
기록 3,109
페이지 98/104
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재고 있음 |
수량 |
시리즈 | 기능 | 인터페이스 | 회로 수 | 전압-공급 | 전류-공급 | 전력 (와트) | 작동 온도 | 장착 유형 | 패키지 / 케이스 | 공급자 장치 패키지 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Microchip Technology |
96-PORT (240G) STS-1 CROSS-CONNE |
2,898 |
|
* | - | - | - | - | - | - | - | - | - | - |
|
|
|
Microchip Technology |
155 MBIT/S ATM AND PACKET-OVER-S |
3,492 |
|
* | - | - | - | - | - | - | - | - | - | - |
|
|
|
Microchip Technology |
20G VT/TU SWITCHING ELEMENT |
2,214 |
|
- | SONET/SDH | Serial | 1 | - | - | - | - | Surface Mount | - | 672-FCBGA (27x27) |
|
|
|
Microchip Technology |
32 LINK, 672 HDLC CHANNEL FRAME |
3,132 |
|
* | - | - | - | - | - | - | - | - | - | - |
|
|
|
Microchip Technology |
33 LINK, 672 HDLC CHANNEL FRAME |
4,842 |
|
* | - | - | - | - | - | - | - | - | - | - |
|
|
|
Microchip Technology |
TEMUX 336NG, PB FREE BUMP |
2,538 |
|
* | - | - | - | - | - | - | - | - | - | - |
|
|
|
Microchip Technology |
84/63 CHAN T1/E1 VT1.5/VT2 MAPPE |
2,448 |
|
- | Framer | E1, T1 | - | - | - | - | - | - | - | - |
|
|
|
Microchip Technology |
DUAL 10G XFI/SFI PHY WITH PREMIU |
8,964 |
|
* | - | - | - | - | - | - | - | Surface Mount | 256-BBGA | 256-FCBGA (17x17) |
|
|
|
Maxim Integrated |
IC TXRX T1/E1/J1 100CSBGA |
7,254 |
|
- | Single-Chip Transceiver | E1, HDLC, J1, T1 | 1 | 3.135V ~ 3.465V | 75mA | - | -40°C ~ 85°C | Surface Mount | 100-LFBGA, CSPBGA | 100-CSBGA (10x10) |
|
|
|
Maxim Integrated |
IC LIU QUAD 256CSBGA |
6,210 |
|
* | - | - | - | - | - | - | - | - | - | - |
|
|
|
Maxim Integrated |
IC LIU QUAD 144CSBGA |
917 |
|
- | Line Interface Unit (LIU) | LIU | 4 | 3.135V ~ 3.465V | 300mA | - | -40°C ~ 85°C | Surface Mount | 144-BGA, CSPBGA | 144-TECSBGA (13x13) |
|
|
|
Broadcom |
INTEGRATED GBE CONTROLLER |
8,316 |
|
- | - | - | - | - | - | - | - | - | - | - |
|
|
|
Broadcom |
INTEGRATED GBE CONTROLLER |
8,784 |
|
- | Ethernet | PCI | 2 | - | - | - | - | Surface Mount | 300-BGA | 300-HBGA |
|
|
|
Broadcom |
INTEGRATED GBE CONTROLLER |
6,984 |
|
- | - | - | - | - | - | - | - | - | - | - |
|
|
|
Broadcom |
INTEGRATED GBE CONTROLLER |
2,574 |
|
- | Ethernet | PCI | 2 | - | - | - | - | Surface Mount | 676-BGA | 676-PBGA (27x27) |
|
|
|
Broadcom |
INTEGRATED GBE CONTROLLER |
4,536 |
|
- | - | - | - | - | - | - | - | - | - | - |
|
|
|
Broadcom |
INTEGRATED GBE CONTROLLER |
3,441 |
|
- | Ethernet | PCI | 1 | - | - | - | - | - | - | - |
|
|
|
Microchip Technology |
MODULE SONET/SDH |
6,606 |
|
- | - | - | - | - | - | - | - | - | - | - |
|
|
|
Microchip Technology |
MODULE SONET/SDH |
2,304 |
|
- | - | - | - | - | - | - | - | - | - | - |
|
|
|
Microchip Technology |
MODULE SONET/SDH |
3,204 |
|
- | - | - | - | - | - | - | - | - | - | - |
|
|
|
Microchip Technology |
MODULE SONET/SDH |
5,130 |
|
- | - | - | - | - | - | - | - | - | - | - |
|
|
|
Maxim Integrated |
IC LIU 6PORT SMD |
6,588 |
|
- | Line Interface Unit (LIU) | LIU | - | 1.8V, 3.3V | - | - | -40°C ~ 85°C | - | - | - |
|
|
|
Broadcom |
DOCSIS EOC MAC |
7,560 |
|
- | C-DOCSIS MAC Chip | SFI | - | - | - | - | 0°C ~ 85°C (TJ) | - | - | - |
|
|
|
Broadcom |
DOCSIS EOC |
482 |
|
- | - | - | - | - | - | - | - | - | - | - |
|
|
|
Broadcom |
DOCSIS EOC |
7,146 |
|
- | - | - | - | - | - | - | - | - | - | - |
|
|
|
Silicon Labs |
IC ISOMODEM SYSTEM-SIDE 24TSSOP |
8,370 |
|
ISOmodem® | Direct Access Arrangement (DAA) | Parallel, SPI, UART | 1 | 3V ~ 3.6V | 15mA | - | 0°C ~ 70°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
|
|
|
Broadcom |
DATA MODEM |
4,428 |
|
- | - | - | - | - | - | - | - | - | - | - |
|
|
|
Broadcom |
SWITCH 100GE-3X 40GE |
5,076 |
|
- | - | - | - | - | - | - | - | - | - | - |
|
|
|
Broadcom |
ETH SWITCH 24FE 4X2.5G MULTILAYE |
3,006 |
|
- | - | - | - | - | - | - | - | - | - | - |
|
|
|
Broadcom |
ETH SWITCH 24FE 4X2.5G MULTILAYE |
8,010 |
|
- | - | - | - | - | - | - | - | - | - | - |