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Texas Instruments introduces the highest resolution pressure sensor signal regulator
2016-04
Sensors
Texas Instruments
[4월 3 2016] Texas Instruments has introduced the industry's highest resolution pressure sensor signal regulator, the PGA900, which enables fast and accurate 24-bit measurements of pressure, stress, flow and liquid levels. The PGA900 signal regulator provides a programmable core for flexible linearization and temperature compensation in many pressure-sensitive bridge sensing applications. The main purpose of ...
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Knowles Corporation introduces the smallest, most efficient digital MEMS microphone on the market with an I²S interface
2016-04
Semiconductors
Knowles
[4월 2 2016] Knowles Corporation, the world's leading supplier of micro acoustic solutions and components, announced the introduction of the most advanced integrated circuit built-in audio bus (Inter-IC Sound or I²S) interface MEMS(micro-electro-mechanical System) microphone. It is used in wearable devices, remote controllers, automotive, and smart home automation and security devices. Knowles Corporation's s ...
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Molex Multi-port Radio Frequency (MPRF) coaxial cable-to-board solution
2016-04
Connectors
Molex
[4월 1 2016] Molex introduces multi-port Radio frequency (MPRF) coaxial wire-to-board solutions to provide printed circuit board (PCB) designers and test and measurement engineers with safe electrical connections for high vibration conditions. The MPRF solution features a robust single-housing design with dual latch to support the weight of the coaxial cable for secure and robust multi-port RF I/O connections ...
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Cypress's new Bluetooth Low Energy solution with extended memory
2016-03
Semiconductors
Cypress Semiconductor
[3월 31 2016] Cypress Semiconductor announced that its highly integrated single-chip Bluetooth Low Energy solution for the Internet of Things and other wireless applications now offers double the memory. The PSoC 4 BLE programmable system-on-chip and PRoC BLE programmable on-chip RF solutions both offer 256KB of flash memory and 32KB of SRAM options, giving designers the flexibility to upgrade firmware over th ...
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Diodes Optimize complementary MOSFETs for increased buck converter power density
2016-03
Connectors
Diodes Incorporated
[3월 30 2016] Diodes Incorporated introduces the complementary dual MOSFET combination DMC1028UFDB designed to increase the power density of DC-DC converters. The new product integrates N-channel MOSFETs and P-channel MOSFETs into a single DFN2020 package. The device is designed for point-of-load converters, providing core voltages from 3.3V down to 1V for ASics. Target applications include Ethernet network co ...
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Microsemi doubles the capacity of the precise Time Protocol client that provides synchronization capabilities for LTE networks
2016-03
Power
Microsemi
[3월 29 2016] Microsemi Corporation, a leading provider of differentiated semiconductor technology solutions in power, security, reliability and performance, announced a doubling of the capacity of its Precise Time Protocol (PTP) client for the TimeProvider 2700 PTP Master Clock (GM) for LTE networks. TimeProvider 2700 now provides concurrent hardware timestamp support for up to 128 PTP clients, making it more ...
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Diodes Step-down converters increase portable product efficiency
2016-03
Connectors
Diodes Incorporated
[3월 28 2016] Diodes Incorporated's new micro step-down DC-DC converter, the AP3403, typically achieves higher than 95% efficiency, extending battery life for smartphones and other low-voltage portable products. This synchronous pulse width modulation converter drives loads up to 600mA and maintains high efficiency by configuring external voltage dividers, capacitors and inductors elements. To support micro li ...
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Microchip introduces the world's first high-end current that supports configurable analog outputs and a two-wire digital bus
2016-03
Connectors
Microchip Technology
[3월 27 2016] Microchip Technology, a global leader in integrated SCM, mixed-signal, emulator and flash patented solutions, introduces the PAC1921, a combination of analog and digital current sensor. The new device is the world's first high-end current sensor to support both digital and configurable analog outputs, with the ability to present power, current or voltage via a single output pin. All power-related ...
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Silicon Labs introduces the industry's most flexible dual-mode Bluetooth module solution
2016-03
Power
Silicon Labs
[3월 26 2016] Silicon Labs, a leading provider of wireless connectivity solutions in the Internet of Things (IoT), announced the launch of its dual-mode Bluetooth Smart Ready module solution. This provides embedded developers with unmatched flexibility to integrate Bluetooth Smart and Bluetooth Basic Rate/Enhanced Data Rate(BR/EDR) wireless technologies while minimizing design time, cost, and complexity. Silic ...
STMicroelectronics introduces easy-to-configure controllers that effectively simplify digital power conversion design
2016-03
Connectors
STMicroelectronics
[3월 25 2016] STMicroelectronics introduces the new STNRG family of digital controllers to help designers maximize the benefits of digital power conversion technology, including high energy efficiency at full load, enhanced security, rich diagnostic capabilities, and easy networking. The high durability of the new products is sufficient to meet the needs of high-end industrial applications as well as a variety ...
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OptiMOSTM 300 V increases the efficiency of hard switching applications and supports new designs
2016-03
Power
Infineon Technologies
[3월 24 2016] Infineon Technologies AG launches OptiMOSTM 300 V, expanding its portfolio of medium voltage MOSFETs and setting a new standard in the power field effect tube market. The launch of the 300V OptiMOSTM helps Infineon further consolidate its market leadership in communication power supplies, uninterruptible power supplies (UPS), motor control, industrial power supplies, and DC/AC inverters. The newl ...
Infineon Technologies presents the latest generation of PrimePACK power modules that take advantage of Infineon's new IGBT generation
2016-03
Power
Infineon Technologies
[3월 23 2016] Infineon Technologies AG introduces the latest generation of PrimePACK power modules that take advantage of Infineon's new IGBT generation. IGBT5 and innovative. The combination of XT technology is an important milestone in the development of IGBT chip and module technology. IGBT5 reduces static and dynamic power losses and increases power density while. XT module process technology extends produ ...