Technology Articles

2015-08 Semiconductors Cypress Semiconductor

[8월 31 2015] Cypress Semiconductor Corporation has announced a new line of energy-harvesting power management integrated circuits (PMIC) for tiny, solar-powered wireless sensors in the Internet of Things (IoT). With the lowest power consumption in the world, the new device is a single-chip energy harvesting PMIC that can use solar panels with an area of only 1 cm2. The new PMIC devices are ideal for battery-f ...

2015-08 Power Qorvo US Inc.

[8월 30 2015] Qorvo, a leading provider of RF solutions for mobile, infrastructure, and aerospace and defense applications, announced the introduction of a hybrid line of gallium nitride (GaN)/ Gallium arsenide (GaAs) power amplifiers to expand range and meet the exploding data throughput requirements of the point-to-point radio link market. Gorden Gook, general manager of Qorvo's Transmission Business unit, s ...

2015-08 Connectors IDT, Integrated Device Technology

[8월 29 2015] IDT has added two new members to its growing family of silicon-based RF voltage Variable attenuators (VVA) - which provide the analog control needed for precise attenuation applications - expanding the company's frequency coverage from 1MHz to 6GHz. Both devices have a bi-directional RF port, support a 3V or 5V single positive supply voltage, and have an operating temperature range of -40°C to 10 ...

2015-08 Power Qualcomm

[8월 28 2015] Qualcomm announced that its subsidiary Qualcomm Technologies, Inc. (QTI), has introduced new versions of its Graphics Processing Unit (GPU) and Image Signal Processing (ISP) units for its next-generation vision processing technology, providing significant advancements in performance, power efficiency and user experience for SnapdragonQUALCOMM processors. The new QUALCOMM Adreno 5XX GPU architectu ...

2015-08 Passive Components KEMET

[8월 27 2015] KEMET Corporation announced the release of its M55 module Polymer Seal (PHS) capacitor portfolio. KEMET's M550 M551 and modular series are designed for mission-critical high capacity and voltage applications and are produced by connecting T550 or T551 polymer-sealed capacitors in parallel. The series M55 is suitable for telecommunications, computer, defense and aerospace applications. With its st ...

2015-08 Semiconductors Cypress Semiconductor

[8월 26 2015] Cypress Semiconductor and THine Electronics have announced the industry's fastest USB 3.0 camera reference design kit with a 13-megapixel resolution at 21 frames per second. The new Ascella design kit is based on Cypress's EZ-USB CX3 USB 3.0 camera controller and THine's THP7312 image signal processor (ISP). With optimized firmware, software development kits, reference circuit diagrams, and relat ...

2015-08 Power Samsung

[8월 25 2015] Samsung Electronics announced that it has begun mass production of the industry's first 256 Gigabit (GB), 3D (3D based on 48-layer 3-bit multistage cell (MLC) arrays for use in solid-state drives (SSDS)) vertical NAND (V-NAND) flash memory. "With our launch of the third-generation V-NAND flash memory to the global market, we can now offer the best advanced memory solution based on improved perfor ...

2015-08 Semiconductors Toshiba Semiconductor and Storage

[8월 24 2015] Toshiba announces PCIe®1 (Peripheral Component Interconnect Express) solid-state drives (SSDS for three different families using the NVMe™2 (non-volatile Memory Express) protocol for a variety of applications, including high-performance notebooks); Lightweight laptops, 2-in-1 / convertible laptops, all-in-one PCS and tablets; And server and storage applications. All three solid-state product line ...

2015-08 Connectors Texas Instruments

[8월 23 2015] TI introduces the industry's first 20A and 30A synchronous DC/DC buck converters. This converter synchronizes noise and EMI/EMC frequency reduction, and a power management bus (PMBus) interface for Adaptive voltage scaling (AVS). TI's SWIFT 20A TPS544B25 and 30A TPS544C25 converters incorporate MOSFETs and are specifically packaged in a small PowerStack square flat leadless (QFN) package to drive ...

2015-08 Power IDT, Integrated Device Technology

[8월 22 2015] IDT Corporation has announced a new RF device that can help TDD cell base station developers significantly reduce power consumption, design solution costs and board area. Operating at frequencies from 3200 MHz to 4000 MHz, the F1358 integrated digital Predistortion (DPD) demodulator provides the industry's highest linearity and integration to improve the performance of the linearized path of the ...

2015-08 Semiconductors Cypress Semiconductor

[8월 21 2015] Cypress Semiconductor, Inc. announced the launch of a 256Mb NOR HyperFlash™ product. The 3.0V S26KL256S HyperFlash is the latest flash memory in the industry to support the high-bandwidth, low-pin HyperBus interface. The device is ideal for high-performance applications, such as automotive dashboards, industrial automation, communication systems, and medical devices that require the highest read ...

2015-08 Connectors ATOP Technologies

[8월 20 2015] Atmel Corporation has released the industry's most innovative single-wire EEPROM product, which requires only two pins, one data pin and one ground pin, to work properly. The range is ideal for the Internet of Things (IoT), wearables, consumables, batteries and cable signage markets. Because the new device product is self-powered, it does not use a power supply or Vcc pin, but adopts a parasitic ...