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NXP has partnered with NVIDIA to integrate the TAO tool suite into NXP Edge devices to accelerate AI deployment
2024-03
Semiconductors
NXP
[3월 25 2024] NXP Semiconductors at NVIDIA GTC announced a partnership with NVIDIA to deploy NVIdia-trained AI models into NXP's broad edge processing portfolio through the eIQ machine learning development environment. The integration of the capabilities of the NVIDIA TAO tool Suite with the NXP eIQ machine learning development environment is exciting, enabling developers to accelerate development in the incre ...
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Molex Uninterruptible Power: At the heart of mission-critical continuity in the data center
2024-03
Power
Molex
[3월 22 2024] The data center's thirst for energy is enormous and will only increase as the digital world continues to expand. The good news is that uninterruptible power systems (UPS) keep data centers up and running during power outages, ensuring that critical applications continue to run in our connected world. Data centers have become the backbone of our new digital economy. Not only do current technologie ...
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Qualcomm launches the third-generation Snapdragon 8s mobile platform to bring industry-leading end-side AI to more smartphones
2024-03
Power
Qualcomm
[3월 22 2024] Qualcomm Technologies announced the launch of the third-generation Snapdragon 8s mobile platform, bringing the most sought-after features of the Snapdragon 8 Series platform to more Android flagship smartphones for an extraordinary top-of-the-line mobile experience. Key features of this new flagship platform include support for powerful end-side generative AI capabilities, always-aware ISP, hyper ...
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OmniVision Technologies has announced the OV50K40 sensor with a dynamic range close to that of the human eye
2024-03
Sensors
OmniVision Technologies Inc
[3월 21 2024] OmniVision Technologies, as an internationally renowned image sensor manufacturer, has recently released an epoch-making product - the OV50K40 sensor, whose performance has reached an unprecedented height in several aspects, especially in dynamic range, which is close to the performance of the human eye. This breakthrough technical achievement marks the image sensor technology has entered a new e ...
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How can SiC devices improve system efficiency in electric vehicles
2024-03
Power
Senix Corporation
[3월 21 2024] SiC devices refer to electronic devices made of Silicon Carbide material. Compared to traditional Silicon devices, SiC devices have higher electronic band width, electron saturation drift speed and thermal conductivity, so they perform better in high voltage, high frequency and other applications. SiC devices are widely used in power electronics, including electric vehicles, due to their excellen ...
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Vishay's new 80V symmetrical dual-channel MOSFETs achieve industry-leading RDS(ON)
2024-03
Passive Components
Vishay
[3월 20 2024] Vishay Intertechnology announced the launch of a new 80 V symmetrical dual-channel N-channel power MOSFET-- SiZF4800LDT, Combine high-side and low-side TrenchFET Gen IV MOSFETs in a 3.3mm x 3.3mm PowerPAIR 3x3FS monocoque package. Vishay Siliconix SiZF4800LDT is suitable for power conversion in industrial and communications applications, enhancing thermal performance, reducing component count and ...
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Nexperia introduces an energy balance calculator to help capture energy and further extend battery life
2024-03
Power
Nexperia
[3월 20 2024] Nexperia has announced the launch of an energy balance calculator. This is a powerful networking tool designed to help battery management engineers maximize the battery life of their applications or achieve battery-free applications. The calculator provides engineers with precise data to help them make informed decisions to integrate Nexperia's energy harvesting PMIC into their systems. At the he ...
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STMicroelectronics expands 3D depth-sensing layout with next-generation time-flight sensors
2024-03
Sensors
STMicroelectronics
[3월 19 2024] STMicroelectronics announced the launch of a versatile, direct Time of Flight (dToF)3D LiDAR(Light Detection and Ranging) module with excellent 2.3k resolution, as well as the first order for an ultra-small 500MP indirect Time of Flight (iToF) sensor. Alexandre Balmefrezol, General manager of ST's Imaging Sub-Products division, said: "ToF sensors can accurately measure the distance from the senso ...
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Texas Instruments' new product line continues to push the limits of power design to help engineers achieve superior power density
2024-03
Connectors
Texas Instruments
[3월 19 2024] Texas Instruments has introduced two new lines of power conversion devices that help engineers achieve higher power in a smaller space, delivering ultra-high power density at a lower cost. Texas Instruments' new 100V integrated Gallium nitride (GaN) power stage features heat-enhanced double-sided cooling package technology that simplifies thermal design for medium-voltage applications and enables ...
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Nexperia has announced the launch of an energy balance calculator
2024-03
Connectors
Nexperia
[3월 18 2024] Nexperia has announced the launch of an energy balance calculator. This is a powerful networking tool designed to help battery management engineers maximize the battery life of their applications or achieve battery-free applications. The calculator provides engineers with precise data to help them make informed decisions to integrate Nexperia's energy harvesting PMIC into their systems. At the he ...
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Infineon launches the second generation CoolSiC MOSFETs to set new standards in power electronics
2024-03
Connectors
Infineon Technologies
[3월 18 2024] In today's society highly dependent on electricity, power loss has become a key factor that cannot be ignored in the field of power electronics. In response to industry demand for more efficient and reliable power processing solutions, Infineon Technologies AG has introduced its new silicon Carbide CoolSiC MOSFET G2 trench technology. This technology sets a new standard for power transmission eff ...
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Microchip introduces 3.3 kV XIFM Plug and Play mSiC gate drivers
2024-03
Connectors
Microchip Technology
[3월 15 2024] The electrification of everything is driving the widespread adoption of silicon carbide (SiC) technology in medium and high voltage applications such as transportation, power grids and heavy-duty vehicles. To help developers deploy SiC solutions and quickly advance the development process, Microchip Technology is introducing the 3.3 kV XIFM Plug-and-play mSiC gate driver with Augmented Switching' ...