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NXP introduces advanced automotive radar single-chip family
2023-04
Semiconductors
NXP
[4월 25 2023] NXP Semiconductor announced the launch of the new 28nm RFCMOS radar single-chip family for next-generation ADAS and autonomous driving systems. The new SAF85xx single-chip family integrates NXP's high-performance radar sensing capabilities and processing technology to provide Tier 1 suppliers and Oems with increased flexibility to support short -, medium - and long-range radar applications to mee ...
Samsung Electronics has unveiled its latest 200-megapixel (200MP) image sensor, ISOCELL HP2
2023-04
Semiconductors
Samsung
[4월 25 2023] Samsung Electronics has launched its latest 200 megapixel (200MP) image sensor, ISOCELL HP2, whose advanced pixel technology and full well capacity will deliver an amazing image experience for future high-end smartphone devices. With a 0.6 micron (μm) size appearance and 1/1.3 inch optical format, it can accommodate 200 megapixels. This is the sensor configuration widely used in high-end smartpho ...
Infineon has introduced a new source base power MOSFET in a 3.3 x 3.3 mm2 PQFN package
2023-04
Semiconductors
Infineon Technologies
[4월 25 2023] Infineon Technologies has introduced a new 3.3 x 3.3 mm2 PQFN package with source base power mosFETs to achieve the highest level of performance and power density in the design of future power electronics systems. The voltage range covers 25-150 V, and there are two different structures: bottom cooling (BSC) and double cooling (DSC). The new product family delivers significant performance improve ...
Infineon has joined hands with Green Hills Software to provide complete automotive safety solutions based on TRAVEO T2G series microcontrollers
2023-04
Semiconductors
Infineon Technologies
[4월 24 2023] Infineon Technologies has partnered with Green Hills Software, a global leader in embedded security, to provide a complete ecosystem for the development and deployment of advanced security applications in the automotive industry. The partnership combines Infineon's leading TRAVEO™ T2G family of body and dashboard microcontrollers with Green Hills' comprehensive, production-proven software solutio ...
Infineon's new pixel technology for indirect Time of Flight (i-ToF) sensors
2023-04
Semiconductors
Infineon Technologies
[4월 24 2023] Infineon Technologies and Uplander (pmd), a quality partner specializing in 3D ToF, have launched the IRS2875C image sensor, a performance advanced version of the IRS2975C. The industry's first image sensor based on Infineon's latest pixel technology, it works using time-of-flight (ToF) technology known as indirect time-of-flight (i-ToF). The IRS2975C's small size and performance are tailored for ...
FTDI Chip FT4232HA USB to UART/MPSSE IC provides high-speed USB support for target designs
2023-04
Power
FTDI, Future Technology Devices International Ltd
[4월 24 2023] FTDI Chip's FT4232HA High speed USB to UART/MPSSE IC. The FT4232HA is a car-standard USB 2.0 to UART adapter IC that seamlessly provides high-speed USB support for target designs. With four separate configurable interfaces, the FT4232HA device provides a highly flexible solution for a range of automotive and general USB applications, including smart card readers, industrial controls, media player ...
Minimal IP67 protection level light touch switch
2023-04
Power
Littelfuse
[4월 24 2023] Littelfuse has announced the launch of a new series of C&K Switches NanoT Micro waterproof tap switches that are surface mounted and extremely flat. The evolution of smart wearables, health monitoring devices, and other battery-powered iot devices is driving the need for higher density active component integration, seamless circular screens, and the addition of functionality into smaller and smal ...
A new precision medium bandwidth signal link platform that can connect a variety of sensors
2023-04
Semiconductors
Analog Devices
[4월 24 2023] Analog Devices(ADI) announced the launch of a new precision medium-bandwidth signal chain platform that improves system performance in DC to approximately 500kHz signal bandwidths for industrial and instrumentation applications. The new platform offers a complete set of signal chains with customizable solution options and comes with a select set of development tools, such as LTspice emulation, to ...
Samsung Electronics has developed its first 12-nanometer DDR5 DRAM
2023-04
Power
Samsung
[4월 24 2023] Samsung Electronics announced that it has successfully developed its first 16 Gb DDR5 DRAM built with 12 nanometer (nm) level technology, and completed a product evaluation with AMD for compatibility. Based on the latest DDR5 standard, Samsung's 12nm level DRAM will unlock speeds of up to 7.2 gigabits per second (Gbps). That means processing two 30GB UHD movies in one second. Jooyoung Lee, senior ...
Samsung High performance PC solid state drive
2023-04
Connectors
Samsung
[4월 24 2023] Samsung has announced production readiness for high-performance PCIe 4.0 NVMe SSD (solid state drive) PM9C1a. The PM9C1a is a new memory product based on Samsung's 5 nanometer (nm) high-end technology and seventh generation V-NAND technology, which will significantly improve the computing and gaming performance of PCS and laptops. The Samsung PM9C1a SSD will be available in a variety of capacity ...
The first Wi-Fi development kit to support the new Matter protocol
2023-04
Optoelectronics
ams
[4월 24 2023] AMS has released its latest Global Shutter CMOS image sensor Mira050 (2.3mm x 2.8mm, 500,000 pixels), further expanding the compact, highly sensitive Mira family of Global shutter CMOS image sensors product portfolio. Mira050 is highly sensitive to visible and near infrared (NIR) light, enabling engineering designers to save space and power in wearable and mobile devices. Mira050 is suitable for ...
Teledyne e2v has announced the launch of 8 GB aerospace grade DDR4 memory
2023-04
Optoelectronics
Teledyne LeCroy
[4월 21 2023] Teledyne e2v has announced the launch of 8 GB of spacegrade DDR4 memory as part of its Edge of Space computing solution. This announcement follows the successful conclusion of all internal de-risking activities, including radiation/latch effect testing and preliminary industrial inspection. As demand for small, high-density memory surges, Teledyne e2v stresses that its latest memory chips are com ...