A new way of electro-optical interconnection: 3D packaging technology details

With the rapid development of technologies such as artificial intelligence, 5G communication, and the Internet of Things, the performance improvement of traditional chips is gradually approaching the physical limit, and Moore's Law is facing failure. In order to break through this bottleneck, 3D packaging technology came into being and has become one of the key technologies to continue Moore's law and improve chip performance. In 3D packaging technology, electro-optical interconnection, as an emerging interconnection method, is showing great potential, opening up a new path for the development of future chips.

一, 3D packaging technology: break through the tradition, three-dimensional integration

The traditional chip package uses a two-dimensional plane structure, where all components are arranged on the same plane and connected by wires. Although this structure is simple and easy to implement, with the increasing complexity of chip functions, 2D packaging faces the problems of low wiring density, large signal delay and high power consumption.

The 3D packaging technology pushes the DJT10E17-8HA chip from the plane to the stereo, and vertically integrates multiple chips or chip modules through stacking and interconnection to form a three-dimensional structure. This structure can greatly shorten the interconnect length, reduce the signal delay and power consumption, improve the wiring density and integration, and provide a new way to improve the chip performance.

二, Electro-optical interconnection: high-speed transmission, low consumption, high efficiency

In 3D packaging technology, the choice of interconnection mode is very important. Although the traditional electrical interconnection method has mature technology, it has bottleneck in high-speed data transmission, and it is difficult to meet the demand for high bandwidth and low delay of future chips.

Electro-optical interconnection uses optical signal for data transmission, which has the advantages of high bandwidth, low delay and anti-electromagnetic interference. Compared to electrical signals, optical signals transmit faster, have lower losses, and are not affected by electromagnetic interference, making them ideal for high-speed data transmission in 3D packages.

三, The application of photoelectric interconnection in three-dimensional packaging

The application of photoelectric interconnection in 3D packaging is mainly reflected in the following aspects:

Inter-chip interconnection: In 3D packaging, the amount of data transmission between different chips is huge, and traditional electrical interconnection methods are difficult to meet the needs. Photoelectric interconnection can provide higher bandwidth and lower latency to achieve high-speed data transmission between chips.

● On-chip interconnection: With the continuous progress of the chip process, the interconnection lines inside the chip are becoming thinner and thinner, and the resistance and capacitance effects are more obvious, resulting in signal delay and increased power consumption. Photoelectric interconnection can replace part of the electrical interconnection, reducing the interconnection delay and power consumption inside the chip.

● Photoelectric fusion: photoelectric interconnection can integrate photoelectric devices and electronic devices on the same chip to achieve photoelectric fusion, providing a new direction for the development of future chips.

四. Technical challenges of optoelectronic interconnection

Although photoelectric interconnect shows great potential in 3D packaging, its development also faces some challenges:

● Process complexity: electro-optical interconnection requires the integration of optical devices such as optical waveguides, optical modulators, and light detectors on the chip, which has high process complexity and relatively high cost.

● Thermal management: photoelectric devices will generate heat when working, how to effectively carry out thermal management is a problem that needs to be solved.

● Standardization: At present, electro-optical interconnection technology is still in the development stage, and the lack of unified standards restricts its promotion and application to a certain extent.

五. Future prospects

Despite the challenges, the application of photoelectric interconnect in 3D packaging is still very promising. With the continuous progress of technology, the process cost of electro-optical interconnection will gradually reduce, and the performance will continue to improve, which is expected to become one of the mainstream interconnection methods in the future 3D packaging.

The combination of electro-optical interconnection and 3D packaging technology will bring revolutionary changes to the development of chips in the future, promote the rapid development of artificial intelligence, 5G communication, Internet of things and other technologies, and bring a more intelligent and convenient life experience to human society.

As a new interconnection method, photoelectric interconnection shows great potential in 3D packaging technology. Its advantages of high speed transmission, low power consumption and high efficiency provide a new way to solve the performance bottleneck faced by traditional chips. Although there are still some challenges, with the continuous progress of technology, electro-optical interconnection is expected to become an important direction of future chip development, and inject new vitality into the progress of information technology.