Allegro MicroSystems delivers compact, integrated, and efficient magnetoelectric flux solutions

Allegro MicroSystems has introduced its latest high-power current sensor, the ACS37220, and the industry's most compact lead-based magnetic current sensor, the ACS37041. Compared to current sensing solutions using separate shunt resistors and operational amplifiers, Allegro's latest solutions offer greater efficiency and reliability, improved system protection, and a reduced material bill.

Existing shunt solutions require the use of multiple components, take up a lot of board space, and often require the inclusion of additional PCB layers and heat sinks to maintain satisfactory thermal efficiency. These factors inevitably lead to an increase in weight and size, as well as the introduction of design complexity, which often leads to higher costs and longer production times.

Allegro's latest sensors effectively solve existing industry challenges with their compact size, improved efficiency and simplified integration. The ACS37220 is designed to replace high-power sensing resistors and is suitable for monitoring high-current applications up to 200A. The ACS37041 offers a high degree of integration in a small SOT23-W package for a wide range of current sensing applications up to 30A.

Allegro's latest current sensors combine the functions of shunt resistors, shunt amplifiers and other passive components into a single package. Due to their compact design and higher efficiency, these sensors are well suited for low pressure applications (< 100 V) compared to traditional shunt systems. They have the following advantages:

--Reduced heat dissipation: The decreased resistance of the lead frames in integrated magnetic current sensors leads to reduced temperatures in the system.

--Streamlined design: By reducing the number of components to be positioned and connected, the process of PCB layout becomes more direct and uncomplicated.

--Allegro’s integrated sensor solutions incorporate the features of a conventional shunt resistor circuit into a single package, making it easier to position components and simplify the design process while reducing the overall bill of materials (BOM).