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Dialog joins the power component market and GaN applications are expected to grow

1월 3 2017 2017-01 Semiconductors Dialog Semiconductor GmbH
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Through TSMC's six-inch fab technology, Dialog launched the DA8801, Dialog's senior vice president of enterprise development and strategy Mark Tyndall said in an interview with CTIMES after the meeting that this component is currently the industry's first product to integrate logic components and GaN FETs into a single chip

     Through TSMC's six-inch fab technology, Dialog launched the DA8801, Dialog's senior vice president of enterprise development and strategy Mark Tyndall said in an interview with CTIMES after the meeting that this component is currently the industry's first product to integrate logic components and GaN FETs into a single chip. TSMC's approach at the six-inch fab is to stack GaN layers on a silicon substrate to further mass-produce the DA8801 power component. The cooperation between Dialog and TSMC is not just starting today, the two sides have been mixed signal and power management for quite some time.

     In the past, TSMC in addition to the advanced process will make more explanations, in other materials, there is not much noise outside, this time TSMC rare use of six-inch fabs into GaN on Silicon technology, then Dialog to obtain the first incense, the primary terminal application, for the smart phone fast charge transformer market. Mark Tyndall revealed that Dialog has a 70% market share in the global fast-charging transformer market, and the launch of the DA8801 is hoping to increase power and further improve charging efficiency under the condition that the transformer volume remains unchanged. Dialog in 2017-18, the goal is to make this 70% of the market gradually switch to GAN-based DA8801, he also said that Dialog and China's top ten mobile phone factories, in the fast charge have its cooperation, it is clear that the market has its growth in Mark Tyndall does not mind, Dialog's primary target market is the relatively large volume of consumer electronics.

     It is worth noting that since TSMC is using six-inch fabs, the production capacity is far less than that of 12-inch and 8-inch fabs, if we want to respond to a large number of market demands at once, whether TSMC can meet the production capacity? While Mark Tyndall can't speak for TSMC, TSMC is more than capable of meeting Dialog's current needs. And in terms of the size of the bare crystal, it is also smaller than the traditional silicon process, so there is no need to worry about the production capacity. In addition, this is the industry's first integrated silicon and GaN power component, Dialog has patent protection to prevent other similar competitors copy.

     Mark Tyndall also said that GaN has been in the market for about a decade, compared with other competitors who have launched products earlier, Dialog's strategy is first to focus on a larger number of applications, and second, this is the first power component to integrate silicon and GaN, so it has its market significance. Dialog does have plans to launch new product lines in the future, such as power load enhancement, to further meet the needs of server applications, but at this stage, Dialog must first establish its footing in the consumer market before moving into the niche market.

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