Infineon HYPERRAM™ 3.0 memory chips are paired with Autotalks third-generation chipsets
Infineon Technologies AG and Autotalks have announced a partnership to provide solutions for the next generation of V2X (Connected to the Vehicle) applications. Infineon will provide car-scale HYPERRAM™ 3.0 memory chips in this collaboration to support A
TEKTON3 is a fully integrated V2X SoC chip specifically designed to support networked vehicle driving operations. V2X enables vehicle-to-vehicle and vehicle-to-environment communication, ultimately improving the safety of road traffic. Concurrent dual-band radio technologies and full V2X software technology implementations often require external memory to manage modem and application requirements. HYPERRAM meets the cost, power density and performance requirements of external memory and is the premier memory chip.
The HYPERRAM 3.0 device from Infineon, with a 16-bit HYPERBUS interface, enables a transfer rate of 800 MBps, further increasing the throughput of Infineon's HYPERRAM family. The HYPERRAM 3.0 device meets the data processing requirements of TEKTON3 and is an ideal extended storage solution.
Amos Freund, Vice President of Research and Development at Autotalks, said: "Infineon's HYPERRAM memory chips and NOR flash memory are ideal partners for our latest generation of V2X SoC products. "We are excited to partner with Infineon, the market leader in memory chips and automotive chips, to create advanced V2X products that will help Oems create tailored V2X solutions."
Patrick Le Bihan, Senior Director of Marketing for the Infineon Technology Ecosystem, said: "The global V2X market is expected to grow at a compound annual growth rate of more than 30% over the next five years, so this collaboration with Autotalks is well-timed. Our HYPERRAM memory chips and NOR flash memory work seamlessly with Autotalks' SoC products to bring customers energy-efficient, low-cost, high-performance solutions. We are delighted to be working with Autotalks, a leading V2X equipment provider, and look forward to continuing our collaboration in the future."
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