Microchip introduces next generation Bluetooth Low power solution

     Microchip Technology, the world's leading provider of integrated microcontroller, mixed-signal, emulator and flash memory patented solutions, announced the launch of the next generation of Bluetooth Low Power (LE) solutions. The IS1870 and IS1871 Bluetooth LE RF ics and the BM70 module comply with the latest Bluetooth 4.2 standard, expanding Microchip's existing Bluetooth portfolio and achieving worldwide regulatory and Bluetooth Technology Alliance (SIG) certification. These new products are ideal for iot and Bluetooth beacon applications, allowing designers to easily take advantage of the low energy consumption and simplicity of Bluetooth low power connectivity.

     Microchip's new Bluetooth low-power devices all include an integrated Bluetooth 4.2 firmware protocol stack. Developers can achieve up to 2.5 times faster data transfer speeds as well as increased connection security and support for government-level (FIPs-based) secure connections. Data will be sent and received over a Bluetooth link in transparent UART mode, making it easy to integrate with any processor or Microchip's hundreds of PIC® microcontrollers with UART interfaces. In addition, the new module also supports independent "host-free" operations for beacon applications.

     Sumit Mitra, Microchip's vice president of Wireless Solutions, said: "The IS1870 and IS1871 ics provide our chip customers with top-notch Bluetooth 4.2 performance, while the BM70 module allows our customers to avoid regulatory certification costs and product delays. By providing one-stop shopping, including our own Bluetooth protocol stack, customers gain proven interoperability and the convenience of one-on-one support from Microchip's team of wireless experts around the world."

     These new devices optimize power distribution to minimize current consumption and thus extend battery life. In addition, these new devices are compact in size, with a minimum RF IC size of 4x4 mm and a minimum module size of 15x12 mm. Module options are available for RF regulatory certification, as well as uncertified (non-shielded/non-antenna) modules for smaller and longer range antenna designs for self-certification of end-product emission.

     Microchip's Bluetooth Low power module includes all the hardware, software and certifications a designer needs. Developers can easily submit their products to the Bluetooth Technology Alliance (SIG) using Microchip's Bluetooth QDID certification. Embedded Bluetooth stack profiles include GAP, GATT, ATT, SMP, and L2CAP, as well as proprietary services for transparent UART. All modules can be configured using Microchip's Windows® operating system based tools.