Molex has introduced a thermal management solution

     Molex has introduced a thermal management solution that reduces the time and cost of deploying and upgrading high-performance data centers to meet the growing demand for generative artificial intelligence and machine learning workflows. The Molex VaporConnect optical Feedthrough module is used for two-phase immersion cooling, and by using a unique cassette design, it is fixed directly to the immersion cooling tank and can replace the optical transceiver and network cabling infrastructure without changing the mechanical interface or affecting the structure of the immersion cooling tank, thus solving the problem of increasing data center speed and capacity.

     Trevor Smith, General Manager of Optical Connectivity at Molex, said: "Molex continues to employ innovative optical solutions to simplify data centre deployment and upgrades while mitigating critical thermal management challenges. "VaporConnect gives customers the flexibility to upgrade connectivity and scale cooling system designs by simply deploying different modules to keep pace with data center developments, which will accelerate upgrades while reducing overall energy, cooling and technology costs."

     These optical feed-through modules use fully upgradeable sealed modules that simplify the connection between the optical transceiver inside the immersion tank and the cable infrastructure outside the tank. With VaporConnect, sealing and wiring is achieved inside the module, allowing customers to upgrade connectors without compromising the immersion tank design or architecture. In addition, customers can reuse standard cabling infrastructure for multiple generations of products, reducing deployment time, cost and complexity.

     For single mode and multimode fiber solutions, a variety of industry standard and company-owned optical connector shapes are available. These solutions also have mixed-match capabilities to upgrade the system to newer or denser connectors. Customizable module packages to meet specific space and application requirements.