Molex introduces four rows of board-to-board connectors

     Molex's four rows of board-to-board connectors. These connectors use a staggered circuit layout and a thin 0.175mm foot spacing design, and are patented to save 30 percent of space compared to traditional connectors. They give product developers and device manufacturers the freedom and flexibility to support compact dimensions and are ideal for augmented/virtual reality (AR/VR), automotive, communications, Internet of Things, healthcare and wearable applications.

     Molex four-row board-to-board connectors are now available in 32 and 36 pin models, with 20 and 64 pin models coming soon. In addition, Molex plans to support the product with up to 100 pins. These devices are suitable for applications such as smart phones, wearables, Internet of Things and smart home devices, AR/VR devices, drones, patient monitoring systems, therapeutic and surgical devices, etc.

     Four rows of Molex board-to-board connectors are rated at 3.0A, enabling high power transmission in compact dimensions. In addition, the product follows standard 0.35mm weld spacing, which speeds up mass production using typical surface mount technology (SMT) processes. Stable and reliable performance of these connectors is ensured by the device's internal armor and insertion mold nail design, which avoids pin damage during mass production and assembly. These features, combined with wide alignment space, help achieve a firm, easy fit and lower drop rate.

     "Molex continues to drive innovation in connectivity, bringing smaller, higher-performance devices to our engineers," said Justin Kerr, vice president and general manager of Molex's Microsolutions business group. With high-density, four-row board-to-board connectors, customers can squeeze more sensors and functionality into smaller and smaller device Spaces without compromising device performance. In doing so, Molex will set a new standard for spatially optimized connectivity."