STMicroelectronics launches Open Development Platform for Secure Vehicle Connected applications

     The Modular Vehicle Information Services Platform (MTP) is an open development environment that enables developers to prototype advanced intelligent driving applications, including vehicle-to-back-office servers, on-road infrastructure connectivity, and shop-floor connectivity. The MTP platform integrates a central processing unit (CPU) module based on ST's recently launched Telemaco3P secure vehicle information processor and a complete set of vehicle networking devices on the circuit board and plug-in modules, ensuring flexibility and scalability of system development.

     The new Telemaco3P in-vehicle safety information processor is already being used by top Oems and Tier 1 suppliers to replace existing automotive processors. At the same time, the MTP development platform can accelerate Telemaco3P application development. The core component of the MTP development platform is ST's Telemaco3P chip, the industry's first automotive processor to integrate a dedicated hardware security module with the most advanced on-chip security features

     The MTP development platform also incorporates ST's Teseo automot-grade multi-satellite system GNSS chip and dead count sensor, and the ST33 on-board safety unit option further enhances the security of Telemaco3P's advanced automotive safety modules. In addition, the platform supports direct connection of the board to the car bus, such as CAN, FlexRay and BroadR-Reach(100Base-T1), while optional technologies such as low energy Bluetooth BluetoothTM, Wi-Fi and LTE modules provide wireless networking capabilities. Designed to meet the needs of advanced in-vehicle information services use cases, including remote diagnostics and over-the-air updates to secure electronic control unit (ECU) firmware, the MTP platform is equipped with expansion connectors for V2X communication and precision positioning modules.