Semiconductor molding process revealed: The story behind the protection of chips

In the modern technological society, semiconductor chips are everywhere, from smart phones to spacecraft, can not be separated from this tiny "brain". But what is less well known is that these sophisticated chips require special protection processes to perform their functions. Semiconductor molding process is such a key technology, it is like putting on a strong "armor" for the chip, so that it can resist the invasion of the external environment.

一.The necessity of chip protection

Semiconductor chips are far more vulnerable than most people think. Under the microscope, the surface of the chip is covered with circuits thinner than a human hair, and these sophisticated structures are highly vulnerable to physical damage. A tiny speck of dust can short-circuit an electrical circuit, and a drop of water can cause irreversible corrosion. What's more, moisture and pollutants in the air can gradually erode the chip's metal wires, leading to performance degradation or even complete failure.

Environmental factors affect the chip in many ways. Temperature changes will cause material expansion and contraction, humidity will cause metal corrosion, ultraviolet light will destroy the structure of the material, electrostatic discharge may break down the circuit. These threats are ever-present and must be met with effective protective measures.

Plastic sealing technology is developed under such needs. It not only protects the chip from physical damage, but also ensures that the chip can still work stably in harsh environments. The development of this technology has witnessed the progress and innovation of the semiconductor industry.

二.The technical core of the plastic sealing process

The choice of plastic sealing material is the key to the process. Modern plastic sealing mainly uses epoxy resin composite materials, which have good insulation, heat resistance and mechanical strength. By adding special fillers, the thermal expansion coefficient of the material can be adjusted to match the chip material and reduce the stress damage.

The precise control of the process flow determines the quality of the plastic seal. First, the chip is fixed on the lead frame, and the AML0603E3N0BT chip is connected to the pin through the gold wire bonding. The assembly is then placed in a mold and injected with molten plastic sealant. Under high temperature and high pressure, the plastic sealing material is cured and formed. This process requires precise control of temperature, pressure and time parameters.

Quality control is the lifeline of plastic sealing process. X-ray inspection of internal structure, ultrasonic scanning to find interface defects, thermal cycling tests to assess reliability. Only products that pass strict testing can enter the next process. These inspection methods ensure that each plastic sealing device meets the design requirements.

三.Technological breakthroughs and future prospects

The research and development of new plastic sealing materials has never stopped. The application of nanocomposites significantly improves the thermal conductivity and mechanical strength of the plastic seals. Low dielectric constant materials reduce signal transmission losses and are suitable for high frequency applications. These innovative materials are driving the development of plastic sealing technology to higher performance.

Process innovation is mainly reflected in the improvement of automation degree. Intelligent production line can monitor process parameters in real time and automatically adjust production conditions. Machine vision systems can quickly identify defects and improve inspection efficiency. These advances have not only improved product quality, but also significantly reduced production costs.

The future development trend is focused on 3D packaging and system level packaging. By stacking multiple chips to achieve vertical interconnection, the integration density is greatly increased. Embedded packaging technology integrates the passive element directly into the plastic encapsulation body, further reducing the size of the device. These new technologies are reshaping the face of semiconductor packaging.

The development of semiconductor molding process reflects human's pursuit of technological perfection. From simple protection in the beginning, to versatile integration today, the technology continues to push the limits. It not only protects the chip, but also provides a solid guarantee for the development of the semiconductor industry. In the future, with the application of new materials and new processes, plastic sealing technology will continue to promote the development of the semiconductor industry and create more possibilities for human beings.