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GigaDevice introduces the GD32F403 series of high-performance basic Cortex-M4 MCUS
2017-03
Power
GigaDevice Semiconductor (HK) Limited
[3월 2 2017] Based on the 168MHz Cortex-M4 core and supporting fast DSP and floating-point operations, GigaDevice GD32F403 Series general purpose MCUS continue to provide industry-leading processing efficiency and balanced interface resource allocation to provide a cost-effective entry point for high-performance computing needs such as industrial manufacturing, smart hardware and the Internet of Things. GigaD ...
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OmniVision and Corephotonics introduce dual camera zoom reference designs for smartphones
2017-03
Power
OmniVision Technologies Inc
[3월 1 2017] OmniVision Technologies, a leading developer of advanced digital imaging solutions, has announced a new dual-camera zoom reference design for mobile devices in partnership with dual-camera technology pioneer Corephotonics. This reference design combines OmniVision's OV12A10 and OV13880 image sensors with Corephotonics' unique zoom and bokeh algorithms to bring optical zoom capabilities typically ...
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Mediatek launches high-precision positioning Global satellite navigation System solutions for automotive and industrial applications
2017-02
Semiconductors
MegaChips Corporation
[2월 28 2017] Mediatek announced the launch of MT3303, a high-precision positioning global satellite navigation system solution for automotive and industrial applications. The solution integrates GNSS and memory chips to support four global satellite navigation system specifications: GPS, Glonass, Galileo and China Beidou. The MT3303 is currently certified for Automotive electronics AEC-Q100 (Stress Test Stand ...
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The ST multi-function accelerometer offers class-leading resolution and low power consumption in a miniature package
2017-02
Connectors
STMicroelectronics
[2월 27 2017] The STMicroelectronics LIS2DW12 3-axis accelerometer offers high measurement accuracy, design flexibility and energy efficiency, supports a variety of low power and low noise Settings, and is available in a 2mm x 2mm x 0.7mm package. Take context awareness of Internet of Things hardware (IoT) and wearables to a whole new level. STMicroelectronics' new family of low-power, high-performance MEMS pr ...
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Lattice Semiconductor introduces the new CrossLink Programmable ASPP (pASSP) IP solution
2017-02
Semiconductors
Lattice Semiconductor Corporation
[2월 26 2017] Lattice Semiconductor, a leading provider of customized intelligent interconnect solutions to the market, announced the launch of the new Lattice CrossLink Programmable ASSP(pASSP)IP solution. With three new CrossLink ips and two CrossLink demo platforms that support MIPI® DSI to LVDS and CMOS to MIPI CSI-2 Bridges, design engineers can implement new video bridging capabilities. Lattice is commit ...
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STMicroelectronics next generation smart power modules up to 100W increase functional integration, energy efficiency and flexibility
2017-02
Semiconductors
STMicroelectronics
[2월 25 2017] STMicroelectronics expands its SLLIMM™ nano family of motor driven Intelligent Power Modules (IPM) product lineup. In addition to a variety of packages that minimize the overall size of the application and minimize design complexity, the new product integrates more practical features and higher energy efficiency with the latest 500V MOSFETs. The new IPM module has a rated output current of 1A or ...
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Analog Devices introduces the industry's first intrinsically safe certified digital isolation product
2017-02
Connectors
Analog Devices
[2월 24 2017] Analog Devices has announced the industry's only certified intrinsically safe (IS) digital isolator based on the IEC 60079-11:2011 standard. These 4-channel ADuM144x series digital isolators feature iCoupler technology and are ideal for electrical equipment designs used in hazardous areas. Analog Devices' IS-certified digital isolators reduce the required printed circuit board space compared to t ...
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Mentor Graphics announced the launch of the 15BG Veloce Strato platform
2017-02
Power
MEAN WELL
[2월 23 2017] Mentor Graphics announced the Veloce Strato hardware-accelerated simulation platform. The Veloce Strato platform is Mentor's third generation data center friendly hardware acceleration simulation platform and the only hardware acceleration simulation platform on the market that is fully scalable in both software and hardware. Mentor also introduced the Veloce StratoM high-capacity hardware-accele ...
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Microsemi announces the industry's lowest power consumption, cost-optimized FPGA product line
2017-02
Connectors
Microsemi
[2월 21 2017] Microsemi Corporation announced the new cost-optimized PolarFire Field Programmable Logic Device (FPGA) product family, offering the industry's lowest power 12.7 Gbps serialization/de-serialization (SerDes) transceiver in the medium density range of FPGA devices. As well as leading safety and reliability. The FPGA product family is suitable for a wide range of applications, including wired access ...
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STMicroelectronics' PC version MCU Finder selection tool
2017-02
Power
STMicroelectronics
[2월 20 2017] STMicroelectronics has released its PC version of the MCU Finder selection tool, which allows embedded developers to directly view key information for STM32 and STM8 microcontrollers in the desktop environment for ST MCU application development. Following the functionality of the popular ST MCU Finder selection tool ST-MCU-Finder on mobile, the PC version ST-MCU-Finder-PC provides users with conv ...
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STMicroelectronics 3MHz chopper op amp uses rail-to-rail input/output and miniature package
2017-02
Semiconductors
STMicroelectronics
[2월 19 2017] STMicroelectronics introduces the TSZ182 precision dual operational amplifier with very low input offset voltage and extremely high temperature drift stability, as well as 3MHz gain bandwidth, rail-to-rail input/output, 2mm x 2mm DFN8 or Mini-SO8 miniature package. The TSZ182 chopper stabilized opamp complements ST's traditional line of popular opamps with extremely high measurement accuracy for ...
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Elmos introduces a new generation of contactless proximity detection and gesture recognition devices for the automotive class
2017-02
Connectors
Elna America
[2월 18 2017] Elmos, a German company, has announced the E909.21 integrated circuit for next-generation optical contactless proximity detection and gesture recognition devices in automobiles. Compared to previous solutions, the new device saves up to 40 percent in material costs and reduces installation area by up to 50 percent. The chip provides users with simple, fast and targeted solutions. In this system, ...