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Technology Articles

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Renesas launches highly commutative triode bidirectional thyristor switching devices

2012-01 Connectors Renesas Electronics America
[1월 9 2012] Renesas Electronics has announced the BCR8LM-14LK, A highly commutative tridirectional triac switching device that supports rated on-state current RMS (IT (RMS)) 8 amps (A) and rated off-state Repeat peak voltage (VDRM) 700 volts, which can be triggered directly by a single chip microcomputer (MCU). The new three-terminal bidirectional thyristor switching device can be used to drive loads such as ...
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Marvell and Google will make the TV the control center of the "connected life.

2012-01 Connectors Maxwell Technologies
[1월 8 2012] Marvell announced the launch of a new generation of forward-looking platforms that will enable major breakthroughs in the convergence of TV, gaming, streaming, web browsing and social media applications. The platform is equipped with the Marvell ARMADA 1500 HD media single-chip system and has been adopted by the next generation Google TV, which will debut at CES 2012. With Marvell's superior Qdeo ...
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Renesas releases its first embedded flash memory technology

2012-01 Power Renesas Electronics America
[1월 7 2012] Renesas Electronics, Inc., a leading global supplier of advanced semiconductors and solutions, has announced the development of the industry's first 40nm process embedded flash memory technology for automotive real-time applications. Renesas will also be the first to introduce 40nm embedded flash microcontrollers (MCUS) for automotive applications using the 40nm process flash technology, with the ...
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Xilinx launched based on 28 nm Kintex™ -7 FPGA target reference design and development substrate

2012-01 Power Xilinx
[1월 6 2012] Xilinx announced a new target reference design and new development substrate based on the 28 nm Kintex™-7 FPGA to accelerate the development of a new generation of 3D and 4K2K display technologies designed to bring richer immersive experiences to consumers. Includes 4K2K Mosaic, HDTV to 4K2K updrive target reference designs, and a new ACDC (Capture, Provide, Distribute, Consume) 1.0 substrate wit ...
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Renesas Electronics announces the industry's first 40nm process embedded flash memory technology for real-time automotive applications

2012-01 Connectors Renesas Electronics America
[1월 5 2012] Renesas Electronics, Inc., a leading global supplier of advanced semiconductors and solutions, has announced the development of the industry's first 40nm process embedded flash memory technology for automotive real-time applications. Renesas will also be the first to introduce 40nm embedded flash microcontrollers (MCUS) for automotive applications using the 40nm process flash technology, with the ...
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Maxim introduces a light sensor that combines ambient light detection and proximity detection

2012-01 Sensors Maxim Integrated
[1월 4 2012] Maxim Integrated Products introduces the MAX44000 digital ambient light and infrared proximity detection sensor that simulates the ambient light detection of the human eye. Designed with the company's proprietary BiCMOS technology, the IC integrates three optical sensors, two ADCs, and digital circuits in a miniature, 2mm x 2mm x 0.6mm package. The highly integrated design saves valuable board sp ...
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Minimal MEMS modules make consumer electronics more flexible

2012-01 Connectors STMicroelectronics
[1월 3 2012] STMicroelectronics has announced an inertial sensor module that integrates triaxial acceleration and angular velocity sensors in a 3x5.5x1mm miniature package. The new product is a six-degree-of-freedom iNEMO sensor module, nearly 20% smaller than ST's existing products, and brings advanced motion sensing capabilities to today's space-constrained consumer electronics applications (such as smartph ...
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Molex introduces CMC standard connectors and welded connectors with press terminals

2012-01 Power Molex
[1월 2 2012] Molex expands its CMC product line with a pin-compatible 1 54 circuit connector, as well as 32 and 112 circuit soldered mounting connectors. Designed specifically for high conductivity and harsh environment applications, the CMC is the industry standard interface for automotive and transportation powertrain applications, including engine control units (ECUs), automatic transmissions, suspension c ...
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STMicroelectronics launches MDmesh V power MOSFET transistor breaking world record

2012-01 Semiconductors STMicroelectronics
[1월 1 2012] STMicroelectronics, a leading global semiconductor supplier across multiple electronic applications, introduces the MDmesh V power MOSFET transistor that breaks the world record for high voltage power MOSFET transistors. The MDmesh V series is already the highest performing power MOSFET transistor on the market, with the lowest on-state resistance per unit area for the highest energy efficiency a ...
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Maxim introduces two mini Lnas to improve GPS reception sensitivity

2010-01 Connectors Maxim Integrated
[1월 11 2010] Maxim has introduced two small, battery-powered LNA (Low Noise Amplifier) models, the MAX2657 and MAX2658, designed for use in the 1575MHz band with GPS capabilities. The two devices combine Maxim's innovative SiGe BiCMOS process and WLP (chip level package) technology with a noise factor of only 0.8dB, greatly improving GPS reception sensitivity. This sensitivity is superior to discrete GaAs and ...
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NXP introduces silicon tuners for global wireless and cable TV reception

2010-01 Semiconductors NXP
[1월 10 2010] As the television industry begins to embrace silicon tuners, NXP Semiconductors announced the TDA18272, a high-performance silicon tuner for global wireless and cable TV reception. The DVB-T2-TDA18272 supports all analog and digital TV standards worldwide, enabling TV manufacturers to prepare for the next generation of TVS. To date, NXP has sold more than 400 million NXP Silicon tuners, contribut ...
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Analog Devices introduces groundbreaking RF circuits for 4G cellular base stations

2010-01 Semiconductors Analog Devices
[1월 9 2010] Analog Devices, the world's leading provider of high-performance signal processing solutions, recently introduced a highly integrated RFIC (Radio frequency Integrated circuit) family designed for LTE (Long Term Evolution) and fourth generation (4G) cell base stations. LTE is an enhanced version of the UMTS (Universal Mobile Telecommunications System) standard, which is seen as the ultimate step t ...