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A new motor drive chip that significantly improves electromechanical thermal management performance for electric vehicles

7월 3 2023 2023-07 Semiconductors Melexis Technologies NV
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Melexis introduces the MLX81334 motor drive chip, which can significantly optimize the electric vehicle thermal valve (precise battery temperature control) and expansion valve (heat pump refrigeration cycle), significantly increasing the range of electric vehicles. With extended memory and over-the-air (OTA) support, the MLX81334 further comples Milai's embedded motor driver chip portfolio for advanced software capabilities.

     Melexis, a global microelectronics engineering company, announced the latest launch of the MLX81334 motor drive chip, which can significantly optimize the thermal valve (precise battery temperature control) and expansion valve (heat pump refrigeration cycle) of electric vehicles, significantly increasing the range of electric vehicles. With extended memory and over-the-air (OTA) support, the MLX81334 further comples Milai's embedded motor driver chip portfolio for advanced software capabilities. Available in a 5mm × 5mm 32-pin QFN package for 12V and 24V automotive systems with integrated overtemperature, overcurrent, overvoltage and undervoltage protection.

     The LIN-based motor driver chip MLX81334 has a current rating of 1A and can be deployed in electromechanical thermal management systems. This single-chip device efficiently drives small DC motors, brushless DC motors or stepper motors. Each chip is equipped with an embedded microcontroller with a 16-bit application processor and a stand-alone communications processor, four FET half-bridge drivers, data conversion circuits, and LIN or serial interfaces. With 64KB of on-chip memory (32KB for the MLX81332), the MLX81334 provides sufficient memory space to run more complex software, and enables more security diagnostics and easy access to critical calibration data. In addition, the MLX81334 also supports OTA updates.

     Melexis has applied its deep expertise in high-voltage silicon on Insulator (SOI) technology to introduce this driver chip, which successfully combines excellent operational stability with a high level of functional integration for high-power operation in a compact form factor. The device takes up very little board space and can be used in electromechanical equipment deployments where space requirements are critical.

     "The new generation of automotive electromechanical equipment has a growing demand for high-power drive hardware with small PCBS, and our single-chip product can bring more compact size heat valves to electric vehicles," Marc Lambrechts, product line manager for embedded motor drive chips at Melexis, said, "By reducing material costs and maintaining excellent cost performance, our automotive customers can develop competitive thermal management systems. In addition, our experienced engineers can provide technical support to help customers achieve the right design once and for all."

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